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a kyocera group company avx surface mount tantalum capacitors
1 index introduction 2 taj ?standard series 4 taj ?low profile series 8 tps ?high performance, low esr 10 tacmicrochip 14 taz ?specialist series 18 cwr09 mil-c-55365/4 22 cwr11 mil-c-55365/8 25 technical summary & application guidelines 28 packaging 42 questions & answers 46 technical publications 48 fax back form 49
2 introduction avx tantalum avx paignton is the divisional headquarters for the tantalum division which has manufacturing locations in paignton in the uk, biddeford in maine, usa, juarez in mexico, lanskroun in the czech republic and el salvador. the division takes its name from the raw material used to make its main products, tantalum capacitors. tantalum is an element extracted from ores found alongside tin and niobium deposits; the major sources of supply are canada, brazil and australasia. so for high volume tantalum capacitors with leading edge technology call us first - avx your global partner . the amount of capacitance possible in a tantalum capacitor is directly related to the type of tantalum powder used to manufacture the anode. the graph following shows how the cv/g has steadily increased over time, thus allowing the production of larger and larger capacitances with the same physical volume. cv/g is the measure used to define the volumetric efficiency of a powder, a high cv/g means a higher capacitance from the same volume. these improvements in the powder have been achieved through close development with the material suppliers. avx tantalum is committed to driving the available technology forwards as is clearly identified by the new tacmicrochip technology and the standard codes under development. if you have any specific requirements, please contact your local avx sales office for details on how avx tantalum can assist you in addressing your future requirements. technology trends 80 70 60 50 40 30 20 10 0 1975 1980 1985 1990 1995 2000 year cv/g ('000s) in line with our desire to become the number one supplier in the world for passive and interconnection components, avx constantly feels the need to look forward and innovate. it is not good enough to market the best products, the customer must have access to a service system which suits their needs and benefits their business. the avx ?ne stop shopping?concept is already beneficial in meeting the needs of major oems while worldwide partnerships with only the premier division of distributors aids the smaller user. helping to market the breadth and depth of our electronic component line card and support our customers are a dedicated team of commercial sales people, applications engineers and product marketing managers. their qualifica- tions are hopefully always appropriate to your commercial need, but as higher levels of technical expertise are required, access directly to the appropriate department is seamless and transparent. total quality starts and finishes with our customer service, and where cost and quality are perceived as given quantities the avx service invariably has us selected as the preferred supplier. facilities are equipped with instant worldwide computer and telecommunication links connected to every sales and pro- duction site worldwide. that ensures that our customers delivery requirements are consistently met wherever in the world they may be. working with the customer - one stop shopping tantalum powder cv/gm
3 introduction avx tantalum avxs focus is customer satisfaction - customer satisfac- tion in the broadest sense: product quality, technical support, product availability and all at a competitive price. in pursuance of the ethos and established goals of our corporate wide qv2000 program, it is the stated objective of avx tantalum to supply our customers with a world class service in the manufacturing and supplying of electronic components which will result in an adequate return on investment. this world class service shall be defined as consistently supplying product and services of the highest quality and reliability. this should encompass, but not be restricted to all aspects of the customer supply chain. in addition any new or changed products, processes or services will be qualified to established standards of quality and reliability. the objectives and guidelines listed above shall be achieved by the following codes of practice: 1. continual objective evaluation of customer needs and expectations for the future and the leverage of all avx resources to meet this challenge. 2. by continually fostering and promoting culture of continu- ous improvement through ongoing training and empowered participation of employees at all levels of the company. 3. by continuous process improvement using sound engi- neering principles to enhance existing equipment, material and processes. this will involve the application of the science of s.p.c. focused on improving the process capability index, cpk. all avx tantalum manufacturing locations are iso9000 approved and paignton is approved to qs9000 - automotive quality system requirements. quality statements applications 2-16 volt low esr low profile case 0603 available low failure rate high volumetric efficiency temperature stability stable over time 50 volt @ 85? 33 volt @ 125? automotive range due second half 1998 high reliability temperature stability qs9000 approved 2-35 volt low esr low profile case 0603 available low failure rate high volumetric efficiency temperature stability stable over time
4 case dimensions: millimeters (inches) taj type c case code see table above 106 capacitance code pf code: 1st two digits represent significant figures 3rd digit represents multiplier (number of zeros to follow) m tolerance k=?0% m=?0% 025 rated dc voltage r packaging consult page 42 for details ** additional characters may be added for special requirements how to order code eia w+0.2 (0.008) l?.2 (0.008) h+0.2 (0.008) w 1 ?.2 (0.008) a+0.3 (0.012) s min. code -0.1 (0.004) -0.1 (0.004) -0.2 (0.008) a 3216 1.6 (0.063) 3.2 (0.126) 1.6 (0.063) 1.2 (0.047) 0.8 (0.031) 1.1 (0.043) b 3528 2.8 (0.110) 3.5 (0.138) 1.9 (0.075) 2.2 (0.087) 0.8 (0.031) 1.4 (0.055) c 6032 3.2 (0.126) 6.0 (0.236) 2.6 (0.102) 2.2 (0.087) 1.3 (0.051) 2.9 (0.114) d 7343 4.3 (0.169) 7.3 (0.287) 2.9 (0.114) 2.4 (0.094) 1.3 (0.051) 4.4 (0.173) e 7343h 4.3 (0.169) 7.3 (0.287) 4.1 (0.162) 2.4 (0.094) 1.3 (0.051) 4.4 (0.173) v 6.1 (0.240) 7.3 (0.287) 3.45?.3 3.1 (0.120) 1.4 (0.055) 3.4 (0.133) (0.136?.012) w 1 dimension applies to the termination width for a dimensional area only. the taj standard series encompasses the five key sizes recognized by major oems throughout the world. the v case size has been added to the taj range to allow high cvs to be offered. the operational temperature is -55? to +85? at rated voltage and up to +125? with voltage derating in applications utilizing recommended series resistance. taj is available in standard and extended ranges. technical data: all technical data relate to an ambient temperature of +25? capacitance range: 0.1? to 470? capacitance tolerance: ?0%; ?0% rated voltage (v r ) % +85?: 2 4 6.3 10 16 20 25 35 50 category voltage (v c ) % +125?: 1.3 2.7 4 7 10 13 17 23 33 surge voltage (v s ) % +85?: 2.7 5.2 8 13 20 26 32 46 65 surge voltage (v s ) % +125?: 1.7 3.2 5 8 12 16 20 28 40 temperature range: -55? to +125? environmental classification: 55/125/56 (iec 68-2) reliability 1% per 1000h at 85? with a 0.1 /v series impedance, 60% confidence level qualification cecc 30801 - 005 issue 1 eia 535baac taj series technical specifications
5 taj series capacitance rated voltage (v r ) at 85? ? code 2v 4v 6.3v 10v 16v 20v 25v 35v 50v 0.10 104 aa 0.15 154 aa/b 0.22 224 aa/b 0.33 334 ab 0.47 474 aa/bc 0.68 684 a a a/b c 1.0 105 a a a b a c 1.5 155 a a a a/b b/c a d c 2.2 225 a a a/b a/b b a b/c d 3.3 335 a a a/b a/b b/c c b d 4.7 475 a a a/b b a b/c a c b c/d b d 6.8 685 a a/b a/b b/c a b/c c b d c d 10 106 a a/b b/c a b/c a c b c/d d ce 15 156 b a b a b/c a c b c/d b dd c 22 226 a b/c a c b a c/d b d c b d c e d 33 336 a/b c b a c/d b d c b d c e dd 47 476 ab a c/d b d c b d cd c d e 68 686 b/c c/d b d c d c e d e 100 107 b/c d c b d c e dv d/e 150 157 bb c/d e dd/ v e 220 227 c/d c/d e dv d/e 330 337 c ee d/e/ v e 470 477 e/ v d e v 680 687 dev 1000 108 de 1500 158 e capacitance and voltage range (letter denotes case code) = standard range = extended range = development range
6 taj series ratings & part number reference avx case capacitance dcl df esr part no. size ? (?) % max. ( ) max. max. @ 100 khz 2 volt @ 85? (1.2 volt @ 125?) taja476*002 a 47 0.9 6 3.0 4 volt @ 85? (2.5 volt @ 125?) taja475*004 a 4.7 0.5 6 7.5 taja685*004 a 6.8 0.5 6 6.5 taja106*004 a 10 0.5 6 6.0 taja156*004 a 15 0.6 6 4.0 tajb156*004 b 15 0.6 6 3.0 taja226*004 a 22 0.9 6 3.5 taja336*004 a 33 1.3 6 3.0 tajb336*004 b 33 1.4 6 2.8 tajb476*004 b 47 1.9 6 2.4 tajb686*004 b 68 2.7 6 1.8 tajc686*004 c 68 2.7 6 1.6 tajb107*004 b 100 4.0 8 1.6 tajc107*004 c 100 4.0 6 1.3 tajc227*004 c 220 8.8 8 1.2 tajd227*004 d 220 8.8 8 0.9 taje337*004 e 330 13.2 8 0.9 6.3 volt @ 85? (4 volt @ 125?) taja225*006 a 2.2 0.5 6 9.0 taja335*006 a 3.3 0.5 6 7.0 taja475*006 a 4.7 0.5 6 6.0 taja685*006 a 6.8 0.5 6 5.0 tajb685*006 b 6.8 0.5 6 4.0 taja106*006 a 10 0.6 6 4.0 tajb106*006 b 10 0.6 6 3.0 taja156*006 a 15 1.0 6 3.5 tajb156*006 b 15 1.0 6 2.5 taja226*006 a 22 1.4 6 3.0 tajb226*006 b 22 1.4 6 2.5 tajc226*006 c 22 1.4 6 2.0 tajb336*006 b 33 2.1 6 2.2 tajc336*006 c 33 2.1 6 1.8 tajb476*006 b 47 3.0 6 2.0 tajc476*006 c 47 3.0 6 1.6 tajd476*006 d 47 3.0 6 1.1 tajb686*006 b 68 4.3 8 1.8 tajc686*006 c 68 4.3 6 1.6 tajd686*006 d 68 4.3 6 0.9 tajc107*006 c 100 6.3 6 1.4 tajd107*006 d 100 6.3 6 0.9 tajc157*006 c 150 9.5 6 1.3 tajd157*006 d 150 9.5 6 0.9 tajc227*006 c 220 13.9 10 1.2 tajd227*006 d 220 13.9 8 0.9 taje337*006 e 330 20.8 8 0.9 taje477*006 e 470 29.6 10 0.9 tajv477*006 v 470 29.6 8 0.9 avx case capacitance dcl df esr part no. size ? (?) % max. ( ) max. max. @ 100 khz 10 volt @ 85? (6.3 volt @ 125?) taja155*010 a 1.5 0.5 6 10.0 taja225*010 a 2.2 0.5 6 7.0 taja335*010 a 3.3 0.5 6 5.5 taja475*010 a 4.7 0.5 6 5.0 tajb475*010 b 4.7 0.5 6 4.0 taja685*010 a 6.8 0.7 6 4.0 tajb685*010 b 6.8 0.7 6 3.0 taja106*010 a 10 1.0 6 3.0 tajb106*010 b 10 1.0 6 2.5 tajc106*010 c 10 1.0 6 2.5 taja156*010 a 15 1.5 6 3.2 tajb156*010 b 15 1.5 6 2.8 tajc156*010 c 15 1.5 6 2.0 tajb226*010 b 22 2.2 6 2.4 tajc226*010 c 22 2.2 6 1.8 tajb336*010 b 33 3.3 6 2.0 tajc336*010 c 33 3.3 6 1.6 tajd336*010 d 33 3.3 6 1.1 tajc476*010 c 47 4.7 6 1.2 tajd476*010 d 47 4.7 6 0.9 tajc686*010 c 68 6.8 6 1.3 tajd686*010 d 68 6.8 6 0.9 tajc107*010 c 100 10.0 6 1.2 tajd107*010 d 100 10.0 6 0.9 tajd157*010 d 150 15.0 8 0.9 taje157*010 e 150 15.0 8 0.9 tajd227*010 d 220 22.0 8 0.9 taje227*010 e 220 22.0 8 0.9 tajd337*010 d 330 33.0 8 0.9 taje337*010 e 330 33.0 8 0.9 tajv337*010 v 330 33.0 8 0.9 taje477*010 e 470 47.0 10 0.9 16 volt @ 85? (10 volt @ 125?) taja105*016 a 1.0 0.5 4 11.0 taja155*016 a 1.5 0.5 6 8.0 taja225*016 a 2.2 0.5 6 6.5 tajb225*016 b 2.2 0.5 6 5.5 taja335*016 a 3.3 0.5 6 5.0 tajb335*016 b 3.3 0.5 6 4.5 taja475*016 a 4.7 0.8 6 4.0 tajb475*016 b 4.7 0.8 6 3.5 taja685*016 a 6.8 1.1 6 3.5 tajb685*016 b 6.8 1.1 6 2.5 tajc685*016 c 6.8 1.1 6 2.5 tajb106*016 b 10 1.6 6 2.8 tajc106*016 c 10 1.6 6 2.0 tajb156*016 b 15 2.4 6 2.5 tajc156*016 c 15 2.4 6 1.8 tajb226*016 b 22 3.5 6 2.3 tajc226*016 c 22 3.5 6 1.6 tajd226*016 d 22 3.5 6 1.1 tajc336*016 c 33 5.3 6 1.5 tajd336*016 d 33 5.3 6 0.9 tajc476*016 c 47 7.5 6 1.4 tajd476*016 d 47 7.5 6 0.9 tajd686*016 d 68 10.8 6 0.9 tajd107*016 d 100 16.0 6 0.9 taje107*016 e 100 16.0 6 0.9 tajd157*016 d 150 24.0 6 0.9 tajv157*016 v 150 24.0 8 0.9 tajv227*016 v 220 35.2 8 0.9 all technical data relates to an ambient temperature of +25? measured at 120 hz, 0.5v rms unless otherwise stated. *insert k for ?0% and m for ?0%. note: we reserve the right to supply higher specification parts in the same case size, to the same reliability standards. for parametric information on development codes, please contact your local avx sales office.
7 taj series avx case capacitance dcl df esr part no. size ? (?) % max. ( ) max. max. @ 100 khz 20 volt @ 85? (13 volt @ 125?) taja684*020 a 0.68 0.5 4 12.0 taja105*020 a 1.0 0.5 4 9.0 taja155*020 a 1.5 0.5 6 6.5 taja225*020 a 2.2 0.5 6 5.3 tajb225*020 b 2.2 0.5 6 3.5 taja335*020 a 3.3 0.7 6 4.5 tajb335*020 b 3.3 0.7 6 3.0 taja475*020 a 4.7 1.0 6 4.0 tajb475*020 b 4.7 1.0 6 3.0 tajc475*020 c 4.7 1.0 6 2.8 tajb685*020 b 6.8 1.4 6 2.5 tajc685*020 c 6.8 1.4 6 2.0 tajb106*020 b 10 2.0 6 2.1 tajc106*020 c 10 2.0 6 1.9 tajb156*020 b 15 3.0 6 2.0 tajc156*020 c 15 3.0 6 2.0 tajd156*020 d 15 3.0 6 1.1 tajc226*020 c 22 4.4 6 1.6 tajd226*020 d 22 4.4 6 0.9 tajc336*020 c 33 6.6 6 1.5 tajd336*020 d 33 6.6 6 0.9 tajd476*020 d 47 9.4 6 0.9 tajd686*020 d 68 13.6 6 0.9 taje686*020 e 68 13.6 6 0.9 tajv107*020 v 100 20.0 8 0.9 25 volt @ 85? (16 volt @ 125?) taja474*025 a 0.47 0.5 4 14.0 taja684*025 a 0.68 0.5 4 10.0 taja105*025 a 1.0 0.5 4 8.0 taja155*025 a 1.5 0.5 6 7.5 tajb155*025 b 1.5 0.5 6 5.0 taja225*025 a 2.2 0.6 6 7.0 tajb225*025 b 2.2 0.6 6 4.5 tajb335*025 b 3.3 0.8 6 3.5 tajc335*025 c 3.3 0.8 6 2.8 tajb475*025 b 4.7 1.2 6 2.8 tajc475*025 c 4.7 1.2 6 2.4 tajb685*025 b 6.8 1.7 6 2.8 tajc685*025 c 6.8 1.7 6 2.0 tajc106*025 c 10 2.5 6 1.8 tajd106*025 d 10 2.5 6 1.2 tajd156*025 d 15 3.8 6 1.0 tajc226*025 c 22 5.5 6 1.4 tajd226*025 d 22 5.5 6 0.9 tajd336*025 d 33 8.3 6 0.9 taje336*025 e 33 8.3 6 0.9 tajd476*025 d 47 11.8 6 0.9 avx case capacitance dcl df esr part no. size ? (?) % max. ( ) max. max. @ 100 khz 35 volt @ 85? (23 volt @ 125?) taja104*035 a 0.1 0.5 4 24.0 taja154*035 a 0.15 0.5 4 21.0 taja224*035 a 0.22 0.5 4 18.0 taja334*035 a 0.33 0.5 4 15.0 taja474*035 a 0.47 0.5 4 12.0 tajb474*035 b 0.47 0.5 4 10.0 taja684*035 a 0.68 0.5 4 8.0 tajb684*035 b 0.68 0.5 4 8.0 taja105*035 a 1.0 0.5 4 7.5 tajb105*035 b 1.0 0.5 4 6.5 taja155*035 a 1.5 0.5 6 7.5 tajb155*035 b 1.5 0.5 6 5.2 tajc155*035 c 1.5 0.5 6 4.5 tajb225*035 b 2.2 0.8 6 4.2 tajc225*035 c 2.2 0.8 6 3.5 tajb335*035 b 3.3 1.2 6 3.5 tajc335*035 c 3.3 1.2 6 2.5 tajb475*035 b 4.7 1.6 6 3.1 tajc475*035 c 4.7 1.6 6 2.2 tajd475*035 d 4.7 1.6 6 1.5 tajc685*035 c 6.8 2.4 6 1.8 tajd685*035 d 6.8 2.4 6 1.3 tajc106*035 c 10.0 3.5 6 1.6 tajd106*035 d 10.0 3.5 6 1.0 tajc156*035 c 15.0 5.3 6 1.4 tajd156*035 d 15.0 5.3 6 0.9 tajd226*035 d 22.0 7.7 6 0.9 taje226*035 e 22.0 7.7 6 0.9 tajd336*035 d 33.0 11.6 6 0.9 50 volt @ 85? (33 volt @ 125?) taja104*050 a 0.1 0.5 4 22.0 taja154*050 a 0.15 0.5 4 15.0 tajb154*050 b 0.15 0.5 4 17.0 taja224*050 a 0.22 0.5 4 18.0 tajb224*050 b 0.22 0.5 4 14.0 tajb334*050 b 0.33 0.5 4 12.0 tajc474*050 c 0.47 0.5 4 8.0 tajc684*050 c 0.68 0.5 4 7.0 tajc105*050 c 1.0 0.5 4 5.5 tajc155*050 c 1.5 0.8 6 4.5 tajd155*050 d 1.5 0.8 6 4.0 tajd225*050 d 2.2 1.1 6 2.5 tajd335*050 d 3.3 1.7 6 2.0 tajd475*050 d 4.7 2.4 6 1.4 tajd685*050 d 6.8 3.4 6 1.0 taje106*050 e 10.0 5.0 8 0.9 ratings & part number reference all technical data relates to an ambient temperature of +25? measured at 120 hz, 0.5v rms unless otherwise stated. *insert k for ?0% and m for ?0%. note: we reserve the right to supply higher specification parts in the same case size, to the same reliability standards. for parametric information on development codes, please contact your local avx sales office.
8 taj series low profile three additional case sizes are available in the taj range offering low profile solid tantalum chip capacitors. designed for applications where maximum height of components above or below board are of prime consideration, this height of 1.2mm equates to that of a standard integrated circuit package after mounting. the s&t footprints are identical to the a&b case size parts. capacitance rated voltage (v r ) at 85? ? code 2v 4v 6.3v 10v 16v 20v 25v 0.10 104 r/s 0.15 154 r/s 0.22 224 r/s 0.33 334 r/s 0.47 474 r/s 0.68 684 r/s r/s/t 1.0 105 r/s r/s/t r/s/t 1.5 155 r/s r/s s t 2.2 225 r/s r/s r/s t t 3.3 335 r/s r/s s/t t 4.7 475 r r/s s/t t r 6.8 685 r s/t t t w 10 106 s r/t r tw 15 156 t x 22 226 wy 33 336 w w 47 476 x 68 686 y wx y 100 107 w y y 150 157 wx 220 227 w x y 330 337 wx y 470 477 xy 680 687 x/y 1000 108 y x = 1.5mm height in a d case footprint case dimensions: millimeters (inches) code eia w+0.2 (0.008) l?.2 (0.008) h max. w 1 ?.1 (0.004) a+0.3 (0.012) s min. code -0.1 (0.004) -0.1 (0.004) r* 2012 1.3 (0.051) 2.05 (0.081) 1.2 (0.047) 1.2 (0.047) 0.5 (0.020) 0.85 (0.033) s** 3216l 1.6 (0.063) 3.2 (0.126) 1.2 (0.047) 1.2 (0.047) 0.8 (0.031) 1.1 (0.043) t** 3528l 2.8 (0.110) 3.5 (0.138) 1.2 (0.047) 2.2 (0.087) 0.8 (0.031) 1.4 (0.055) w 3.2 (0.126) 6.0 (0.236) 1.5 (0.059) 2.2 (0.087) 1.3 (0.051) 2.9 (0.114) y 4.3 (0.169) 7.3 (0.287) 2.0 (0.079) 2.4 (0.094) 1.3 (0.051) 4.4 (0.173) * 0805 equivalent ** low profile versions of a & b case w 1 dimension applies to the termination width for a dimensional area only. pad stand-off is 0.1?.1. capacitance and voltage range (letter denotes case code) = standard range = development range
9 taj series low profile ratings & part number reference all technical data relates to an ambient temperature of +25? measured at 120 hz, 0.5v rms unless otherwise stated. *insert k for ?0% and m for ?0%. note: we reserve the right to supply higher specification parts in the same case size, to the same reliability standards. avx case capacitance dcl df esr part no. size ? (?) % max. ( ) max. max. @ 100 khz 2 volt tajr475*002 r 4.7 0.5 6 20.0 tajr685*002 r 6.8 0.5 6 20.0 tajs106*002 s 10.0 0.5 6 20.0 4 volt tajr225*004 r 2.2 0.5 6 25.0 tajs225*004 s 2.2 0.5 6 25.0 tajr335*004 r 3.3 0.5 6 20.0 tajs335*004 s 3.3 0.5 6 18.0 tajr475*004 r 4.7 0.5 6 12.0 tajs475*004 s 4.7 0.5 6 10.0 tajs685*004 s 6.8 0.5 6 8.0 tajt685*004 t 6.8 0.5 6 6.0 tajr106*004 r 10.0 0.5 6 10.0 tajt106*004 t 10.0 0.5 6 5.0 6.3 volt tajr155*006 r 1.5 0.5 6 25.0 tajs155*006 s 1.5 0.5 6 25.0 tajr225*006 r 2.2 0.5 6 20.0 tajs225*006 s 2.2 0.5 6 18.0 tajr335*006 r 3.3 0.5 6 12.0 tajs335*006 s 3.3 0.5 6 9.0 tajs475*006 s 4.7 0.5 6 7.5 tajt475*006 t 4.7 0.5 6 6.0 tajt685*006 t 6.8 0.5 6 5.0 tajt156*006 t 15.0 1.0 6 4.5 tajw336*006 w 33.0 2.1 6 2.0 10 volt tajr105*010 r 1.0 0.5 4 25.0 tajs105*010 s 1.0 0.5 4 25.0 tajr155*010 r 1.5 0.5 6 20.0 tajs155*010 s 1.5 0.5 6 20.0 tajr225*010 r 2.2 0.5 6 15.0 tajs225*010 s 2.2 0.5 6 12.0 tajs335*010 s 3.3 0.5 6 8.0 tajt335*010 t 3.3 0.5 6 6.0 tajt475*010 t 4.7 0.5 6 5.0 tajt685*010 t 6.8 1.0 6 4.0 tajt106*010 t 10.0 1.0 6 3.0 tajy686*010 y 68 6.8 6 0.9 tajy107*010 y 100 10 6 0.9 avx case capacitance dcl df esr part no. size ? (?) % max. ( ) max. max. @ 100 khz 16 volt tajr684*016 r 0.68 0.5 4 25.0 tajs684*016 s 0.68 0.5 4 25.0 tajr105*016 r 1.0 0.5 4 20.0 tajs105*016 s 1.0 0.5 4 15.0 tajt105*016 t 1.0 0.5 4 15.0 tajs155*016 s 1.5 0.5 6 12.0 tajt225*016 t 2.2 0.5 6 6.5 tajt335*016 t 3.3 0.5 6 5.0 tajw106*016 w 10.0 1.6 6 2.0 20 volt tajr104*020 r 0.1 0.5 4 25.0 tajs104*020 s 0.1 0.5 4 25.0 tajr154*020 r 0.15 0.5 4 25.0 tajs154*020 s 0.15 0.5 4 25.0 tajr224*020 r 0.22 0.5 4 25.0 tajs224*020 s 0.22 0.5 4 25.0 tajr334*020 r 0.33 0.5 4 25.0 tajs334*020 s 0.33 0.5 4 25.0 tajr474*020 r 0.47 0.5 4 25.0 tajs474*020 s 0.47 0.5 4 25.0 tajr684*020 r 0.68 0.5 4 25.0 tajs684*020 s 0.68 0.5 4 25.0 tajt684*020 t 0.68 0.5 4 15.0 tajr105*020 r 1.0 0.5 4 20.0 tajs105*020 s 1.0 0.5 4 12.0 tajt105*020 t 1.0 0.5 4 9.0 tajt155*020 t 1.5 0.5 6 6.5 tajt225*020 t 2.2 0.5 6 6.0 for parametric information on development codes, please contact your local avx sales office.
10 tps series low esr tps type d case size see table above 107 capacitor code pf code: 1st two digits represent significant figures, 3rd digit represents multiplier (number of zeros to follow) m tolerance k=?0% m=?0% 010 rated dc voltage r packaging consult page 42 for details 0100 maximum esr in milliohms *see note below how to order the tps surface mount products have inherently low esr (equivalent series resistance) and are capable of higher ripple current handling, producing lower ripple voltages, less power and heat dissipation than standard product for the most efficient use of circuit power. tps has been designed, manufactured, and preconditioned for optimum performance in typical power supply applications. by combining the latest improvements in tantalum powder technology, improved manufacturing processes, and applica- tion specific preconditioning tests, avx is able to provide a technologically superior alternative to the standard range. note: the eia & cecc standards for low esr solid tantalum capacitors allow an esr movement to 1.25 times catalog limit post mounting technical data: all technical data relate to an ambient temperature of +25? capacitance range: 1.5? to 470? capacitance tolerance: ?0%; ?0% rated voltage (v r ) % +85?: 6.3 10 16 20 25 35 category voltage (v c ) % +125?: 4 7 10 13 17 23 surge voltage (v s ) % +85?: 8 13 20 26 32 46 surge voltage (v s ) % +125?: 5 8 12 16 20 28 temperature range: -55? to +125? environmental classification: 55/125/56 (iec 68-2) reliability: 1% per 1000h at 85? with 0.1 /v series impedance, 60% confidence level technical specifications case dimensions: millimeters (inches) code eia w+0.2 (0.008) l?.2 (0.008) h+0.2 (0.008) w 1 ?.2 (0.008) a+0.3 (0.012) s min. code -0.1 (0.004) -0.1 (0.004) -0.2 (0.008) a 3216 1.6 (0.063) 3.2 (0.126) 1.6 (0.063) 1.2 (0.047) 0.8 (0.031) 1.1 (0.043) b 3528 2.8 (0.110) 3.5 (0.138) 1.9 (0.075) 2.2 (0.087) 0.8 (0.031) 1.4 (0.055) c 6032 3.2 (0.126) 6.0 (0.236) 2.6 (0.102) 2.2 (0.087) 1.3 (0.051) 2.9 (0.114) d 7343 4.3 (0.169) 7.3 (0.287) 2.9 (0.114) 2.4 (0.094) 1.3 (0.051) 4.4 (0.173) e 7343h 4.3 (0.169) 7.3 (0.287) 4.1 (0.162) 2.4 (0.094) 1.3 (0.051) 4.4 (0.173) v 6.1 (0.240) 7.3 (0.287) 3.45 ?.3 3.1 (0.120) 1.4 (0.055) 3.4 (0.133) (0.136?.012) w 1 dimension applies to the termination width for a dimensional area only.
11 tps series low esr capacitance rated voltage (v r ) at 85? ? code 6.3v 10v 16v 20v 25v 35v 1.5 155 a(3000) 3.3 335 a(3500) 4.7 475 a(1800) b(1500) c(600) 6.8 685 d(300) 10 106 a(1800) b(1000) c(500) e(200) c(450) 15 156 a(1500) a(1000) b(800) c(450) d(300) 22 226 b(700) c(375) d(200) d(400) e(200-300) 33 336 b(600) c(375-500) c(300) d(200) e(175-300) d(300) c(350) 47 476 c(350) d(150-200) e(150) d(250) 68 686 d(150) e(125-150) v(95-300) c(200) d(125-150) 100 107 c(150) d(65-140) e(100-150) v(85-200) e(125) 150 157 d(125) d(100) d(150) v(75) d (150) 220 227 d(100) e(60-150) v(75-150) v(60) e(100-150) d(150) 330 337 v(60-100) e(60-100) v(60-100) e(50-200) 470 477 v(55-100) e(50-200) esr limits quoted in brackets are in milliohms capacitance and voltage range (letter denotes case code)
12 tps series low esr ratings & part number reference avx case capacitance rated dcl df esr 100khz ripple current (ma) ratings part no. size ? voltage (?) % max. (m ) max. max. @100khz 25? 85? 125? tpsa156*006r1500 a 15 6.3 0.9 6 1500 224 200 89 tpsb336*006r0600 b 33 6.3 2.1 6 600 376 337 151 tpsc107*006r0150 c 100 6.3 6.3 6 150 856 766 343 tpsd157*006r0125 d 150 6.3 9.5 6 125 1095 980 438 tpsd227*006r0100 d 220 6.3 13.9 6 100 1225 1095 490 tpse337*006r0100 e 330 6.3 20.8 8 100 1285 1149 514 tpse337*006r0125 e 330 6.3 20.8 8 125 1149 1028 460 tpse337*006r0150 e 330 6.3 20.8 8 150 1049 938 420 tpsv337*006r0060 v 330 6.3 20.8 8 60 2041 1826 816 tpsv337*006r0100 v 330 6.3 20.8 8 100 1581 1414 632 tpse477*006r0050 e 470 6.3 29.6 10 50 1817 1625 727 tpse477*006r0100 e 470 6.3 29.6 10 100 1285 1149 514 tpse477*006r0200 e 470 6.3 29.6 10 200 908 812 363 tpsv477*006r0055 v 470 6.3 29.6 10 55 2132 1907 853 tpsv477*006r0100 v 470 6.3 29.6 10 100 1581 1414 632 tpsa106*010r1800 a 10 10 1.0 6 1800 204 183 82 tpsa156*010r1000 a 15 10 1.5 6 1000 274 245 110 tpsb226*010r0700 b 22 10 2.2 6 700 348 312 139 tpsc336*010r0375 c 33 10 3.3 6 375 542 484 217 tpsc336*010r0500 c 33 10 3.3 6 500 469 420 188 tpsc476*010r0350 c 47 10 4.7 6 350 561 501 224 tpsc107*010r0200 c 100 10 10.0 8 200 742 663 297 tpsd107*010r0065 d 100 10 10.0 6 65 1519 1359 608 tpsd107*010r0080 d 100 10 10.0 6 80 1369 1225 547 tpsd107*010r0100 d 100 10 10.0 6 100 1225 1095 490 tpsd107*010r0125 d 100 10 10.0 6 125 1095 980 438 tpsd107*010r0140 d 100 10 10.0 6 140 1035 926 414 tpsd107*010r0150 d 100 10 10.0 6 150 1000 894 400 tpse107*010r0125 e 100 10 10.0 6 125 1149 1028 460 tpsd157*010r0100 d 150 10 15.0 6 100 1225 1095 490 tpsd227*010r0150 d 220 10 22.0 8 150 1000 894 400 tpse227*010r0060 e 220 10 22.0 8 60 1658 1483 663 tpse227*010r0100 e 220 10 22.0 8 100 1285 1149 514 tpse227*010r0125 e 220 10 22.0 8 125 1149 1028 460 tpse227*010r0150 e 220 10 22.0 8 150 1049 938 420 tpsv227*010r0060 v 220 10 22.0 8 60 2041 1826 817 tpsd337*010r0150 d 330 10 33.0 8 150 1000 894 400 tpse337*010r0060 e 330 10 33.0 8 60 1658 1483 663 tpse337*010r0100 e 330 10 33.0 8 100 1285 1149 514 tpsv337*010r0060 v 330 10 33.0 8 60 2041 1826 817 tpsv337*010r0100 v 330 10 33.0 10 100 1581 1414 632 tpse477*010r0050 e 470 10 47.0 10 50 1817 1625 727 tpse477*010r0100 e 470 10 47.0 10 100 1285 1149 514 tpse477*010r0200 e 470 10 47.0 10 200 908 812 363
13 tps series low esr ratings & part number reference avx case capacitance rated dcl df esr 100khz ripple current (ma) ratings part no. size ? voltage (?) % max. (m ) max. max. @100khz 25? 85? 125? tpsa335*016r3500 a 3.3 16 0.5 6 3500 146 131 59 tpsb156*016r0800 b 15 16 2.4 6 800 326 292 130 tpsc226*016r0375 c 22 16 3.5 6 375 542 484 217 tpsc336*016r0300 c 33 16 5.3 6 300 606 542 242 tpsc476*016r0350 c 47 16 7.5 6 350 561 501 224 tpsd476*016r0150 d 47 16 7.5 6 150 1000 894 400 tpsd476*016r0200 d 47 16 7.5 6 200 866 775 346 tpsd686*016r0150 d 68 16 10.9 6 150 1000 894 400 tpsd107*016r0125 d 100 16 16.0 6 125 1095 980 438 tpsd107*016r0150 d 100 16 16.0 6 150 1000 894 400 tpse107*016r0100 e 100 16 16.0 6 100 1285 1149 514 tpse107*016r0125 e 100 16 16.0 6 125 1149 1028 460 tpse107*016r0150 e 100 16 16.0 6 150 1049 938 420 tpsd157*016r0150 d 150 16 24.0 8 150 1000 894 400 tpsv157*016r0075 v 150 16 24.0 8 75 1826 1633 730 tpse227*016r0100 e 220 16 35.2 8 100 1285 1149 514 tpsv227*016r0075 v 220 16 35.2 8 75 1826 1633 730 tpsv227*016r0150 v 220 16 35.2 10 150 1291 1155 516 tpsa475*020r1800 a 4.7 20 0.9 6 1800 204 183 82 tpsb106*020r1000 b 10 20 2.0 6 1000 292 261 117 tpsc156*020r0450 c 15 20 3.0 6 450 494 442 198 tpsd336*020r0200 d 33 20 6.6 6 200 866 775 346 tpse476*020r0150 e 47 20 9.4 6 150 1049 938 420 tpse686*020r0125 e 68 20 13.6 6 125 1149 1028 160 tpse686*020r0150 e 68 20 13.6 6 150 1049 938 420 tpsv107*020r0085 v 100 20 20.0 8 85 1715 1534 686 tpsv107*020r0200 v 100 20 20.0 10 200 1118 1000 447 tpsa155*025r3000 a 1.5 25 0.5 6 3000 158 141 63 tpsb475*025r1500 b 4.7 25 1.2 6 1500 238 213 95 tpsc106*025r0500 c 10 25 2.5 6 500 469 420 188 tpsd226*025r0200 d 22 25 5.5 6 200 866 775 346 tpse336*025r0175 e 33 25 8.3 6 175 971 868 388 tpse336*025r0200 e 33 25 8.3 6 200 908 812 363 tpse336*025r0300 e 33 25 8.3 6 300 742 663 297 tpsd476*025r0250 d 47 25 11.8 6 250 775 693 310 tpsv686*025r0095 v 68 25 17.0 8 95 1622 1451 649 tpsv686*025r0150 v 68 25 17.0 10 150 1291 1155 516 tpsv686*025r0300 v 68 25 17.0 10 300 913 816 365 tpsc475*035r0600 c 4.7 35 1.6 6 600 428 383 171 tpsd106*035r0300 d 10 35 3.5 6 300 707 632 283 tpse106*035r0200 e 10 35 3.5 6 200 908 812 363 tpsc156*035r0450 c 15 35 5.3 6 450 494 442 198 tpsd156*035r0300 d 15 35 5.3 6 300 707 632 283 tpsd226*035r0400 d 22 35 7.7 6 400 612 548 245 tpse226*035r0200 e 22 35 7.7 6 200 908 812 363 tpse226*035r0300 e 22 35 7.7 6 300 742 663 297 tpsd336*035r0300 d 33 35 11.6 6 300 707 632 283
14 tacmicrochip the worlds smallest surface mount tantalum capacitor, small enough to create space providing room for ideas to grow. tacmicrochip is a major breakthrough in miniaturization without reduction in performance. it offers you the highest energy store in an 0603 or 0805 case size; enhanced high frequency operation through unique esr performance with temperature and voltage stability. case dimensions: millimeters (inches) code eia w +0.20 (0.008) l +0.25 (0.010) h +0.20 (0.008) code -0.10 (0.004) -0.15 (0.006) -0.10 (0.004) l 0603 0.85 (0.033) 1.6 (0.063) 0.85 (0.033) r 0805 1.35 (0.053) 2.0 (0.079) 1.35 (0.053) lw h standard capacitance range (letter denotes case code) capacitance rated voltage at 85? ? code 2v 3v 4v 6.3v 10v 0.47 474 l 0.68 684 l 1.0 105 l l 1.5 155 l l l 2.2 225 l l ll 3.3 335 ll ll r 4.7 475 l ll r 6.8 685 ll r r 10.0 106 r r 15.0 156 r r 22.0 226 r r 33.0 336 rrr 47.0 476 rr = standard range = extended range = development range
15 tacmicrochip tac type tacmicrochip l case code 225 capacitance code pf code: 1st two digits represent significant figures, 3rd digit represents multiplier (number of zeros to follow) m tolerance k=?0% m=?0% 003 rated dc voltage r packaging x=8mm 4-1/4" tape & reel r=7" tape & reel solder plated ** additional characters may be add for special requirements how to order avx case capacitance leakage df esr style size ?@120hz ? % max (max) max @100khz (2 volt) tac 0603 3.3 0.5 6 10 tac 0603 4.7 0.5 6 10 tac 0603 6.8 0.5 6 10 (3 volt) tac 0603 2.2 0.5 6 10 tac 0603 3.3 0.5 6 10 tac 0603 4.7 0.5 6 10 (4 volt) tac 0603 1.5 0.5 6 10 tac 0603 2.2 0.5 6 10 tac 0603 3.3 0.5 6 10 (6.3 volt) tac 0603 1.0 0.5 6 10 tac 0603 1.5 0.5 6 10 tac 0603 2.2 0.5 6 10 (10 volt) tac 0603 0.47 0.5 6 12 tac 0603 0.68 0.5 6 10 tac 0603 1.0 0.5 6 10 tac 0603 1.5 0.5 6 10 avx case capacitance leakage df esr style size ?@120hz ? % max (max) max @100khz (2 volt) tac 0805 22 0.5 8 6 tac 0805 33 0.7 8 6 tac 0805 47 1.0 8 6 (3 volt) tac 0805 15 0.5 8 6 tac 0805 22 0.7 8 6 tac 0805 33 1.0 8 6 (4 volt) tac 0805 10 0.5 8 6 tac 0805 15 0.6 8 6 tac 0805 22 0.9 8 6 (6.3 volt) tac 0805 6.8 0.5 8 6 tac 0805 10 0.6 8 6 tac 0805 15 0.9 8 6 (10 volt) tac 0805 4.7 0.5 8 6 tac 0805 6.8 0.7 8 6 tac 0805 10 1.0 8 6 ratings and part number reference
16 tacmicrochip continued investment in r&d has resulted in avx introducing revolutionary technology to the tantalum capacitor market. the new tacmicrochip breaks new ground with the unique structure allowing 10 times more capacitance to be packaged in the 0603 case size than is possible with traditional technology. conventional molded tantalum technology results in an increase in esr for each reduction in case size. figure 1 shows a reduction in esr performance of the tacmicrochip compared to the same case size if con- ventional technology were used. figure 2 shows a major leap forward in ?/mm 3 performance. the cv values offered in the 0603 cannot be achieved using conventional molded technology. these features coupled with the temperature and voltage stability of tantalum, enable system designers to achieve equipment miniaturization without compromis- ing performance, making tacmicrochip the optimum choice for size critical applications. tacl155m004 esr with frequency 10 1 0.1 1e+02 1e+03 1e+04 1e+06 1e+07 1e+08 1e+05 frequency (hz) esr (ohms) tacmicrochip technology conventional technology value added 35 30 25 20 15 10 5 0 dcb case size average esr (ohms) a 0805 0603 value added tacmicrochip average molded average 9 8 7 6 5 4 3 2 1 0 87 88 89 90 91 92 f (mm 3 ) 93 94 95 96 97 98 tacl155m006 cap. with temperature 1.58 1.56 1.54 1.52 1.50 1.48 1.46 1.44 1.42 1.40 -60 -40 -20 0 20 40 temperature ( c) capacitance ( f) 60 80 100 120 140 enhancing leakage current & battery efficiency. as portable electronic equipment becomes an integral part of everyday life, a key design focus becomes the ability to enhance and extend battery efficiency per- formance. overall leakage current capability improve- ments are achieved using the unique tacmicrochip construction technology. enhanced esr & high frequency operation. the radically new construction technique used to manufacture the tacmicrochip eliminates a great many of the parasitic inductance resistance paths inherent in standard molded tantalum capacitors, giving the tacmicrochip an equivalent high frequency perfor- mance of larger sized product. volumetric efficiency, space & weight savings. achieving the industries highest available capacitance in 0603 case size allows high bulk energy storage with minimal use of valuable circuit board space. add stable temperature and voltage performance and tacmicrochip becomes your preferred choice of minia- ture tantalum chip capacitor for size critical applications. figure 1. figure 2. tacl155m006 dcl vs voltage 70 60 50 40 30 20 10 0 0123 voltage (v) dcl (na) 456
17 tacmicrochip surface mounting chip soldering wire bonding within the semiconductor chip package other possible configurations for the wafer capacitor quads arrays the manufacturing techniques used to make the tacmicrochip allow avx to offer various custom options. some examples of which are shown above. please contact your local avx sales office if you have a specific requirement.
18 case width length height term. width term. length ??min code w?.38 (0.015) l?.38 (0.015) h?.38 (0.015) w 1 a+0.13 (0.005) ?egular a 1.27 (0.050) 2.54 (0.100) 1.27 (0.050) 1.27?.13 0.76 (0.030) 0.38 (0.015) (0.050?.005) b 1.27 (0.050) 3.81 (0.150) 1.27 (0.050) 1.27?.13 0.76 (0.030) 1.65 (0.065) (0.050?.005) d 2.54 (0.100) 3.81 (0.150) 1.27 (0.050) 2.41+0.13/-0.25 0.76 (0.030) 1.65 (0.065) (0.095+0.005/-0.010) e 2.54 (0.100) 5.08 (0.200) 1.27 (0.050) 2.41+0.13/-0.25 0.76 (0.030) 2.92 (0.115) (0.095+0.005/-0.010) f 3.43 (0.135) 5.59 (0.220) 1.78 (0.070) 3.30?.13 0.76 (0.030) 3.43 (0.135) (0.130?.005) g 2.79 (0.110) 6.73 (0.265) 2.79 (0.110) 2.67?.13 1.27 (0.050) 3.56 (0.140) (0.105?.005) h 3.81 (0.150) 7.24 (0.285) 2.79 (0.110) 3.68+0.13/-0.51 1.27 (0.050) 4.06 (0.160) (0.145+0.005/-0.020) taz series the taz molded surface mount series is designed for use in applications utilizing either solder, conductive adhesive or ther- mal compression bonding techniques. case sizes (a through h) are compatible with cwr06 pad layouts and are qualified as the cwr09 style. the two styles are interchangeable per mil-c-55365/4. each chip is marked with polarity, capacitance code and rated voltage. there are three termination finishes available: fused solder plated (standard) (??per mil-c-55365), hot solder dipped (?? and gold plated (??. in addition, the molding compound has been selected to meet the flammability requirements of ul94v-o and outgassing requirements of nasa sp-r-0022a. additional special case sizes are available. contact your local sales office for details. technical specifications note: for solder coated terminations add 0.38 (0.015) max. to length and height dimensions. technical data all technical data relate to an ambient temperature of +25? capacitance range 0.1? to 220? capacitance tolerance ?0%; ?0% rated voltage (v r ) % +85?: 4 6.3 10 15 20 25 35 50 category voltage (v c ) % +125?: 2.7 4 7 10 13 17 23 33 surge voltage (v s ) % +85?: 5.2 8 13 20 26 33 46 65 surge voltage (v s ) % +125?: 3.2 5 8 12 16 20 28 40 operating temperature range -55? to +125? reliability 1% per 1000h at 85? with a 0.1 /v series impedance, 60% confidence level qualification mil-c-55365/4 case dimensions: millimeters (inches)
19 taz series taz (professional grade) type d case code see table on page 18 335 capacitance code pf code: 1st two digits represent significant figures, 3rd digit represents multiplier (number of zeros to follow) m tolerance j=?% k=?0% m=?0% 015 rated dc voltage c lead configuration c = chip x = extended range r packaging consult page 44 for details sz* manufacturing routing and failure rate* s = standard z = not applicable 0000* termination finish* 0000 = fused solder plated 0800 = hot solder dipped 0900 = gold plated marking the positive end of body has videcon readable polarity bar marking along with the capacitance code and rated work voltage: ?polarity stripe (+) ?capacitance code ?voltage rating typical lead frame material thicknesses lead frame: alloy 194 thickness: 0.005?.0002" 0000 - fused solder plate: (60/40) 60-135 microinches nickel 300?5 microinches fused solder 0800 - hot solder dipped: (60/40) 50-100 microinches nickel min. 60 microinches solder 0900 - gold plated: 35-100 microinches nickel 50-75 microinches gold how to order * not applicable to european orders (other endings are assigned by the factory for special customer requirements) the electrical and mechanical parameters shown on the taz series are general. for specific circuit applications, special screening is available. please contact avx if you have special electrical or mechanical requirements. capacitance rated voltage (v r ) at 85? ? code 4v 6v 10v 15v 20v 25v 35v 50v 0.1 104 a 0.15 154 a 0.22 224 ab 0.33 334 ab 0.47 474 a b 0.68 684 a b a bd 1.0 105 a a b b de 1.5 155 a b d e f 2.2 225 a b a d b e d f 3.3 335 b a d b e de fg 4.7 475 b a d b e de fgh 6.8 685 d b e d f e g f h 10 106 d b e d f e g h 15 156 e d f e g f h 22 226 d f ee g f h gh 33 336 f e gh 47 476 g h fh 68 686 g h fg h 100 107 h fg h 150 157 g 220 227 h capacitance and voltage range (letter denotes case code) = standard range = extended range note: taz standard range ratings are also available as cwr09 military parts, see page 22.
20 taz series standard range ratings & part number reference (standard range and special case sizes only) all technical data relates to an ambient temperature of +25?. capacitance and df are measured at 120 hz, 0.5v rms with a maximum dc bias of 2.2 volts. dcl is measured at rated voltage after 5 minutes. ?insert j for ?% tolerance, k for ?0%, m for ?0% * insert letter for packing option. see ordering information on page 19. the electrical and mechanical parameters shown on the taz series are general. for special circuit requirements, application specific testing is available. please contact your local avx sales office if you have special electrical or mechanical requirements. dcl, df and esr limits are general information only. contact avx if your application requires lower or tighter limits. avx case capacitance dcl df esr part no. size ? (?) % max. ( ) max. max. @ 100 khz 25 volt @ 85? (16 volt @ 125?) taza334(?025c* a 0.33 1.0 6 25.0 tazb684(?025c* b 0.68 1.0 6 15.0 tazd155(?025c* d 1.5 1.0 6 10.0 taze225(?025c* e 2.2 1.0 6 8.0 tazf475(?025c* f 4.7 2.0 6 6.0 tazg685(?025c* g 6.8 2.0 6 4.0 tazg106(?025c* g 10.0 3.0 6 3.0 tazh156(?025c* h 15.0 4.0 6 2.0 35 volt @ 85? (23 volt @ 125?) taza224(?035c* a 0.22 1.0 6 25.0 tazb474(?035c* b 0.47 1.0 6 20.0 tazd105(?035c* d 1.0 1.0 6 12.0 taze155(?035c* e 1.5 1.0 6 6.0 tazf335(?035c* f 3.3 1.0 6 6.0 tazg475(?035c* g 4.7 2.0 6 3.0 tazh685(?035c* h 6.8 3.0 6 3.0 50 volt @ 85? (33 volt @ 125?) taza104(?050c* a 0.10 1.0 6 30.0 taza154(?050c* a 0.15 1.0 6 30.0 tazb224(?050c* b 0.22 1.0 6 25.0 tazb334(?050c* b 0.33 1.0 6 25.0 tazd684(?050c* d 0.68 1.0 6 20.0 taze105(?050c* e 1.0 1.0 6 12.0 tazf155(?050c* f 1.5 1.0 6 10.0 tazf225(?050c* f 2.2 2.0 6 6.0 tazg335(?050c* g 3.3 2.0 6 4.0 tazh475(?050c* h 4.7 3.0 6 2.0 avx case capacitance dcl df esr part no. size ? (?) % max. ( ) max. max. @ 100 khz 4 volt @ 85? (2.5 volt @ 125?) taza225(?004c* a 2.2 1.0 6 20.0 tazb475(?004c* b 4.7 1.0 6 10.0 tazd106(?004c* d 10.0 1.0 6 10.0 taze156(?004c* e 15.0 1.0 8 5.0 tazf336(?004c* r 33.0 2.0 8 4.0 tazg686(?004c* f 68.0 3.0 10 2.0 tazh107(?004c* h 100.0 4.0 10 1.0 6.3 volt @ 85? (4 volt @ 125?) taza155(?006c* a 1.5 1.0 6 12.0 tazb335(?006c* b 3.3 1.0 6 12.0 tazd685(?006c* d 6.8 1.0 6 12.0 taze106(?006c* e 10.0 1.0 6 6.0 tazf226(?006c* f 22.0 2.0 8 4.0 tazg476(?006c* g 47.0 3.0 10 2.0 tazh686(?006c* h 68.0 4.0 10 2.0 10 volt @ 85? (6.3 volt @ 125?) taza105(?010c* a 1.0 1.0 6 18.0 tazb225(?010c* b 2.2 1.0 6 12.0 tazd475(?010c* d 4.7 1.0 6 10.0 taze685(?010c* e 6.8 1.0 6 4.0 tazf156(?010c* f 15.0 2.0 6 3.0 tazg336(?010c* g 33.0 3.0 10 3.0 tazh476(?010c* h 47.0 5.0 10 2.0 15 volt @ 85? (10 volt @ 125?) taza684(?015c* a 0.68 1.0 6 22.0 tazb155(?015c* b 1.5 1.0 6 15.0 tazd335(?015c* d 3.3 1.0 6 10.0 taze475(?015c* e 4.7 1.0 6 6.0 tazf106(?015c* f 10.0 2.0 6 5.0 tazg226(?015c* g 22.0 4.0 8 3.0 tazh336(?015c* h 33.0 5.0 8 2.0 20 volt @ 85? (13 volt @ 125?) taza474(?020c* a 0.47 1.0 6 20.0 tazb684(?020c* b 0.68 1.0 6 15.0 tazb105(?020c* b 1.0 1.0 6 15.0 tazd225(?020c* d 2.2 1.0 6 10.0 taze335(?020c* e 3.3 1.0 6 8.0 tazf685(?020c* f 6.8 2.0 6 5.0 tazg156(?020c* g 15.0 3.0 6 3.0 tazh226(?020c* h 22.0 4.0 6 2.0
21 taz series extended range ?insert j for ?% tolerance, k for ?0%, m for ?0% * insert letter for packing option. see ordering information on page 19. all technical data relates to an ambient temperature of +25?. capacitance and df are measured at 120 hz, 0.5v rms with a maximum dc bias of 2.2 volts. dcl is measured at rated voltage after 5 minutes. the electrical and mechanical parameters shown on the taz series are general. for special circuit requirements, application specific testing is available. please contact your local avx sales office if you have special electrical or mechanical requirements. dcl, df and esr limits are general information only. contact avx if your application requires lower or tighter limits. note: voltage ratings are minimum values. we reserve the right to supply higher voltage ratings in the same case size, to the same reliability standards. avx case capacitance dcl df esr part no. size ? (?) % max. ( ) max. max. @ 100 khz 15 volt taza105(?015x* a 1 1 6 22 tazb335(?015x* b 3.3 1 6 12 tazd475(?015x* d 4.7 1 6 10 taze106(?015x* e 10 2 6 6 tazf226(?015x* f 22 3 6 5 tazh686(?015x* h 68 10 8 2 20 volt taza684(?020x* a 0.68 1 6 22 tazb225(?020x* b 2.2 1 6 12 tazd335(?020x* d 3.3 1 6 10 taze475(?020x* e 4.7 1 6 8 taze685(?020x* e 6.8 2 6 8 tazf156(?020x* f 15 3 6 4 tazg226(?020x* g 22 4 8 3 tazh476(?020x* h 47 10 8 2 25 volt tazb105(?025x* b 1 1 6 12 tazd225(?025x* d 2.2 1 6 10 taze335(?025x* e 3.3 1 6 8 tazf685(?025x* f 6.8 2 6 6 tazh226(?025x* h 22 6 8 2 35 volt tazh106(?035x* h 10 4 8 2 avx case capacitance dcl df esr part no. size ? (?) % max. ( ) max. max. @ 100 khz 4 volt taza475(?004x* a 4.7 1 6 20 tazb106(?004x* b 10 1 6 10 tazd226(?004x* d 22 1 8 10 taze336(?004x* e 33 2 8 5 tazf107(?004x* f 100 4 10 4 tazg157(?004x* g 150 6 10 2 6 volt taza335(?006x* a 3.3 1 6 18 tazb685(?006x* b 6.8 1 6 12 tazd156(?006x* d 15 1 6 10 taze226(?006x* e 22 2 6 4 tazf686(?006x* f 68 4 8 4 tazg107(?006x* g 100 6 10 2 tazh227(?006x* h 220 10 10 1 10 volt taza225(?010x* a 2.2 1 6 20 tazb475(?010x* b 4.7 1 6 12 tazd685(?010x* d 6.8 1 6 8 tazd106(?010x* d 10 1 6 10 taze156(?010x* e 15 2 6 4 taze226(?010x* e 22 3 6 4 tazf476(?010x* f 47 4 8 3 tazg686(?010x* g 68 6 10 2 tazh107(?010x* h 100 10 10 1 ratings & part number reference
22 cwr09 series mil-c-55365/4 marking polarity stripe (+) capacitance code cwr09 type f voltage c=4 d=6 f=10 h=15 j=20 k=25 m=35 n=50 b termination finish b=gold plated c=hot solder dipped k=solder fused 225 capacitance code k tolerance j=?% k=?0% m=?0% m failure rate exponential: m=1%/1000 hours p=0.1%/1000 hours r=0.01%/1000 hours s=0.001%/1000 hours weibull: b=0.1%/1000 hours c=0.01%/1000 hours a optional surge current a=10 cycles at 25? b=10 cycles at -55? and +85? \tr packaging bulk (standard if nothing is specified in this position) \tr=7" tape & reel \tr13=13" tape & reel \w=waffle pack how to order (mil-c-55365/4) notes: cwr09 is fully interchangeable with cwr06. case sizes correspond to taz a through h. packaging information can be found on page 44. 20v rated voltage
23 cwr09 series mil-c-55365/4 mil-c-55365/4 case rated capacitance dc leakage (max.) dissipation factor (max.) max. esr part size w voltage (nom.) 100 khz number (85?) (?) +25? +85? +125? +25? +85/125? -55? +25? (see note) (volts) (?) (?) (?) (%) (%) (%) style cwr09 (ohms) cwr09c*225?@ nh a 4 2.2 1.0 10 12 6 8 8 8.0 cwr09c*475?@ nh b 4 4.7 1.0 10 12 6 8 8 8.0 cwr09c*685?@ nh c 4 6.8 1.0 10 12 6 8 8 5.5 cwr09c*106?@ nh d 4 10.0 1.0 10 12 8 8 10 4.0 cwr09c*156?@ nh e 4 15.0 1.0 10 12 8 10 12 3.5 cwr09c*336?@ nh f 4 33.0 2.0 20 24 8 10 12 2.2 cwr09c*686?@ nh g 4 68.0 3.0 30 36 10 12 12 1.1 cwr09c*107?@ nh h 4 100.0 4.0 40 48 10 12 12 0.9 cwr09d*155?@ nh a 6 1.5 1.0 10 12 6 8 8 8.0 cwr09d*335?@ nh b 6 3.3 1.0 10 12 6 8 8 8.0 cwr09d*475?@ nh c 6 4.7 1.0 10 12 6 8 8 5.5 cwr09d*685?@ nh d 6 6.8 1.0 10 12 6 8 8 4.5 cwr09d*106?@ nh e 6 10.0 1.0 10 12 8 10 12 3.5 cwr09d*226?@ nh f 6 22.0 2.0 20 24 8 10 12 2.2 cwr09d*476?@ nh g 6 47.0 3.0 30 36 10 12 12 1.1 cwr09d*686?@ nh h 6 68.0 4.0 40 48 10 12 12 0.9 cwr09f*105?@ nh a 10 1.0 1.0 10 12 6 8 8 10.0 cwr09f*225?@ nh b 10 2.2 1.0 10 12 6 8 8 8.0 cwr09f*335?@ nh c 10 3.3 1.0 10 12 6 8 8 5.5 cwr09f*475?@ nh d 10 4.7 1.0 10 12 6 8 8 4.5 cwr09f*685?@ nh e 10 6.8 1.0 10 12 6 8 8 3.5 cwr09f*156?@ nh f 10 15.0 2.0 20 24 8 8 10 2.5 cwr09f*336?@ nh g 10 33.0 3.0 30 36 10 12 12 1.1 cwr09f*476?@ nh h 10 47.0 5.0 50 60 10 12 12 0.9 cwr09h*684?@ nh a 15 0.68 1.0 10 12 6 8 8 12.0 cwr09h*155?@ nh b 15 1.5 1.0 10 12 6 8 8 8.0 cwr09h*225?@ nh c 15 2.2 1.0 10 12 6 8 8 5.5 cwr09h*335?@ nh d 15 3.3 1.0 10 12 6 8 8 5.0 cwr09h*475?@ nh e 15 4.7 1.0 10 12 6 8 8 4.0 cwr09h*106?@ nh f 15 10.0 2.0 20 24 6 8 8 2.5 cwr09h*226?@ nh g 15 22.0 4.0 40 48 8 8 10 1.1 cwr09h*336?@ nh h 15 33.0 5.0 50 60 8 8 10 0.9 cwr09j*474?@ nh a 20 0.47 1.0 10 12 6 8 8 14.0 cwr09j*684?@ nh b 20 0.68 1.0 10 12 6 8 8 10.0 cwr09j*105?@ nh b 20 1.0 1.0 10 12 6 8 8 12.0 cwr09j*155?@ nh c 20 1.5 1.0 10 12 6 8 8 6.0 cwr09j*225?@ nh d 20 2.2 1.0 10 12 6 8 8 5.0 cwr09j*335?@ nh e 20 3.3 1.0 10 12 6 8 8 4.0 cwr09j*685?@ nh f 20 6.8 2.0 20 24 6 8 8 2.4 cwr09j*156?@ nh g 20 15.0 3.0 30 36 6 8 8 1.1 cwr09j*226?@ nh h 20 22.0 4.0 40 48 6 8 8 0.9 electrical ratings for cwr09 capacitors * = termination finish b = gold plated c = hot solder dipped k = solder fused ? = tolerance code j = ?% k = ?0% m = ?0% @ = failure rate level exponential: m = 1.0% per 1000 hours p = 0.1% per 1000 hours r = 0.01% per 1000 hours s = 0.001% per 1000 hours weibull: b = 0.1% per 1000 hours c = 0.01% per 1000 hours n = optional surge current a = 10 cycles at 25? b = 10 cycles at -55? and +85? h = packaging bulk standard \tr=7" tape & reel \tr13=13" tape & reel \w=waffle pack w the c case has limited availability. where possible d case should be substituted.
24 cwr09 series mil-c-55365/4 * = termination finish b = gold plated c = hot solder dipped k = solder fused ? = tolerance code j = ?% k = ?0% m = ?0% @ = failure rate level exponential: m = 1.0% per 1000 hours p = 0.1% per 1000 hours r = 0.01% per 1000 hours s = 0.001% per 1000 hours weibull: b = 0.1% per 1000 hours c = 0.01% per 1000 hours n = optional surge current a = 10 cycles at 25? b = 10 cycles at -55? and +85? h = packaging bulk standard \tr=7" tape & reel \tr13=13" tape & reel \w=waffle pack electrical ratings for cwr09 capacitors mil-c-55365/4 case rated capacitance dc leakage (max.) dissipation factor (max.) max. esr part size w voltage (nom.) 100 khz number (85?) (?) +25? +85? +125? +25? +85/125? -55? +25? (see note) (volts) (?) (?) (?) (%) (%) (%) style cwr09 (ohms) cwr09k*334?@ nh a 25 0.33 1.0 10 12 6 8 8 15.0 cwr09k*684?@ nh b 25 0.68 1.0 10 12 6 8 8 7.5 cwr09k*105?@ nh c 25 1.0 1.0 10 12 6 8 8 6.5 cwr09k*155?@ nh d 25 1.5 1.0 10 12 6 8 8 6.5 cwr09k*225?@ nh e 25 2.2 1.0 10 12 6 8 8 3.5 cwr09k*475?@ nh f 25 4.7 2.0 20 24 6 8 8 2.5 cwr09k*685?@ nh g 25 6.8 2.0 20 24 6 8 8 1.2 cwr09k*106?@ nh g 25 10.0 3.0 30 36 6 8 8 1.4 cwr09k*156?@ nh h 25 15.0 4.0 40 48 6 8 8 1.0 cwr09m*224?@ nh a 35 0.22 1.0 10 12 6 8 8 18.0 cwr09m*474?@ nh b 35 0.47 1.0 10 12 6 8 8 10.0 cwr09m*684?@ nh c 35 0.68 1.0 10 12 6 8 8 8.0 cwr09m*105?@ nh d 35 1.0 1.0 10 12 6 8 8 6.5 cwr09m*155?@ nh e 35 1.5 1.0 10 12 6 8 8 4.5 cwr09m*335?@ nh f 35 3.3 1.0 10 12 6 8 8 2.5 cwr09m*475?@ nh g 35 4.7 2.0 20 24 6 8 8 1.5 cwr09m*685?@ nh h 35 6.8 3.0 30 36 6 8 8 1.3 cwr09n*104?@ nh a 50 0.10 1.0 10 12 6 8 8 22.0 cwr09n*154?@ nh a 50 0.15 1.0 10 12 6 8 8 17.0 cwr09n*224?@ nh b 50 0.22 1.0 10 12 6 8 8 14.0 cwr09n*334?@ nh b 50 0.33 1.0 10 12 6 8 8 12.0 cwr09n*474?@ nh c 50 0.47 1.0 10 12 6 8 8 8.0 cwr09n*684?@ nh d 50 0.68 1.0 10 12 6 8 8 7.0 cwr09n*105?@ nh e 50 1.0 1.0 10 12 6 8 8 6.0 cwr09n*155?@ nh f 50 1.5 1.0 10 12 6 8 8 4.0 cwr09n*225?@ nh f 50 2.2 2.0 20 24 6 8 8 2.5 cwr09n*335?@ nh g 50 3.3 2.0 20 24 6 8 8 2.0 cwr09n*475?@ nh h 50 4.7 3.0 30 36 6 8 8 1.5 note: to complete the mil-c-55365/4 part number, additional information must be added: contact your local avx sales office for latest qualification status. w the c case has limited availability. where possible d case should be substituted.
25 case w l h w 2 ph 2 code ?.1 (?.004) ?.3 (?.012) (min) a 1.6?.2 3.2?.2 1.6?.2 1.2 0.8 0.7 (0.063?.008) (0.126?.008) (0.063?.008) (0.047) (0.031) (0.028) b 2.8?.2 3.5?.2 1.9?.2 2.2 0.8 0.7 (0.110?.008) (0.138?.008) (0.075?.008) (0.087) (0.031) (0.028) c 3.2?.3 6.0?.3 2.5?.3 2.2 1.3 1.0 (0.126?.012) (0.236?.012) (0.098?.012) (0.087) (0.0.51) (0.039) d 4.3?.3 7.3?.3 2.8?.3 2.4 1.3 1.0 (0.169?.012) (0.287?.012) (0.110?.012) (0.094) (0.0.51) (0.039) case dimensions: millimeters (inches) cwr11 style mil-c-55365/8 polarity stripe ??for jan brand capacitance code rated voltage (with manufacturers id) how to order ( mil-c-55365/8) marking cwr11 type f voltage c=4 d=6 f=10 h=15 j=20 k=25 m=35 n=50 a termination finish b=gold plated c=hot solder dipped k=solder fused 225 capacitance code k tolerance j=?% k=?0% m=?0% m failure rate exponential: m=1%/1000 hours p=0.1%/1000 hours r=0.01%/1000 hours s=0.001%/1000 hours weibull: b=0.1%/1000 hours c=0.01%/1000 hours d=0.001%/1000 hours a optional surge current a=10 cycles at 25? b=10 cycles at -55? and +85? \tr packaging bulk (standard if nothing is specified in this position) \tr=7" tape & reel \tr13=13" tape & reel \w=waffle pack
26 cwr11 style mil-c-55365/8 electrical ratings for cwr11 capacitors mil-c-55365/8 case rated capacitance dc leakage (max.) dissipation factor (max.) max. part size voltage (nom.) esr number (85?) (?) +25? +85? +125? +25? +85/125? -55? 100 khz (see note) (volts) (?) (?) (?) (%) (%) (%) ( ) cwr11d*155?@ nh a 6 1.5 0.5 5.0 6.0 6 9 9 8.0 cwr11d*225?@ nh a 6 2.2 0.5 5.0 6.0 6 6 9 8.0 cwr11d*335?@ nh a 6 3.3 0.5 5.0 6.0 6 9 9 8.0 cwr11d*475?@ nh b 6 4.7 0.5 5.0 6.0 6 9 9 5.5 cwr11d*685?@ nh b 6 6.8 0.5 5.0 6.0 6 6 9 4.5 cwr11d*106?@ nh b 6 10.0 0.6 6.0 7.2 6 9 9 3.5 cwr11d*156?@ nh c 6 15.0 0.9 9.0 10.8 6 6 9 3.0 cwr11d*226?@ nh c 6 22.0 1.4 14.0 16.8 6 9 9 2.2 cwr11d*476?@ nh d 6 47.0 2.8 28.0 33.6 6 6 9 1.1 cwr11f*105?@ nh a 10 1.0 0.5 5.0 6.0 4 6 6 10.0 cwr11f*155?@ nh a 10 1.5 0.5 5.0 6.0 6 6 9 8.0 cwr11f*225?@ nh a 10 2.2 0.5 5.0 6.0 6 9 9 8.0 cwr11f*335?@ nh b 10 3.3 0.5 5.0 6.0 6 9 9 5.5 cwr11f*475?@ nh b 10 4.7 0.5 5.0 6.0 6 9 9 4.5 cwr11f*685?@ nh b 10 6.8 0.7 7.0 8.4 6 9 9 3.5 cwr11f*156?@ nh c 10 15.0 1.5 15.0 18.0 6 6 9 2.5 cwr11f*336?@ nh d 10 33.0 3.3 33.0 39.6 6 6 9 1.1 cwr11h*684?@ nh a 15 0.68 0.5 5.0 6.0 4 6 6 12.0 cwr11h*105?@ nh a 15 1.0 0.5 5.0 6.0 4 6 9 10.0 cwr11h*155?@ nh a 15 1.5 0.5 5.0 6.0 6 9 9 8.0 cwr11h*225?@ nh b 15 2.2 0.5 5.0 6.0 6 9 9 5.5 cwr11h*335?@ nh b 15 3.3 0.5 5.0 6.0 6 8 9 5.0 cwr11h*475?@ nh b 15 4.7 0.7 7.0 8.4 6 9 9 4.0 cwr11h*106?@ nh c 15 10.0 1.6 16.0 19.2 6 8 9 2.5 cwr11h*226?@ nh d 15 22.0 3.3 33.0 39.6 6 8 9 1.1 cwr11j*474?@ nh a 20 0.47 0.5 5.0 6.0 4 6 6 14.0 cwr11j*684?@ nh a 20 0.68 0.5 5.0 6.0 4 6 6 12.0 cwr11j*105?@ nh a 20 1.0 0.5 5.0 6.0 4 6 6 10.0 cwr11j*155?@ nh b 20 1.5 0.5 5.0 6.0 6 9 9 6.0 cwr11j*225?@ nh b 20 2.2 0.5 5.0 6.0 6 8 9 5.0 cwr11j*335?@ nh b 20 3.3 0.7 7.0 8.4 6 9 9 4.0 cwr11j*475?@ nh c 20 4.7 1.0 10.0 12.0 6 8 9 3.0 cwr11j*685?@ nh c 20 6.8 1.4 14.0 16.8 6 9 9 2.4 cwr11j*156?@ nh d 20 15.0 3.0 30.0 36.0 6 8 9 1.1 * = termination finish b = gold plated c = hot solder dipped k = solder fused ? = tolerance code j = ?% k = ?0% m = ?0% @ = failure rate level exponential: m = 1.0% per 1000 hours p = 0.1% per 1000 hours r = 0.01% per 1000 hours s = 0.001% per 1000 hours weibull: b = 0.1% per 1000 hours c = 0.01% per 1000 hours d = 0.001% per 1000 hours n = optional surge current a = 10 cycles at 25? b = 10 cycles at -55? and +85? h = packaging bulk standard \tr=7" tape & reel \tr13=13" tape & reel \w=waffle pack note: to complete the mil-c-55365/8 part number, additional information must be added: contact your local avx sales office for latest qualification status.
27 cwr11 style mil-c-55365/8 electrical ratings for cwr11 capacitors mil-c-55365/8 case rated capacitance dc leakage (max.) dissipation factor (max.) max. part size voltage (nom.) esr number (85?) (?) +25? +85? +125? +25? +85/125? -55? 100 khz (see note) (volts) (?) (?) (?) (%) (%) (%) ( ) cwr11k*334?@ nh a 25 0.33 0.5 5.0 6.0 4 6 6 15.0 cwr11k*474?@ nh a 25 0.47 0.5 5.0 6.0 4 6 6 14.0 cwr11k*684?@ nh b 25 0.68 0.5 5.0 6.0 4 6 6 7.5 cwr11k*105?@ nh b 25 1.0 0.5 5.0 6.0 4 6 6 6.5 cwr11k*155?@ nh b 25 1.5 0.5 5.0 6.0 6 8 9 6.5 cwr11k*225?@ nh c 25 2.2 0.6 6.0 7.2 6 9 9 3.5 cwr11k*335?@ nh c 25 3.3 0.9 9.0 10.8 6 8 9 3.5 cwr11k*475?@ nh c 25 4.7 1.2 12.0 14.4 6 9 9 2.5 cwr11k*685?@ nh d 25 6.8 1.7 17.0 20.4 6 9 9 1.4 cwr11k*106?@ nh d 25 10.0 2.5 25.0 30.0 6 8 9 1.2 cwr11m*104?@ nh a 35 0.10 0.5 5.0 6.0 4 6 6 24.0 cwr11m*154?@ nh a 35 0.15 0.5 5.0 6.0 4 6 6 21.0 cwr11m*224?@ nh a 35 0.22 0.5 5.0 6.0 4 6 6 18.0 cwr11m*334?@ nh a 35 0.33 0.5 5.0 6.0 4 6 6 15.0 cwr11m*474?@ nh b 35 0.47 0.5 5.0 6.0 4 6 6 10.0 cwr11m*684?@ nh b 35 0.68 0.5 5.0 6.0 4 6 6 8.0 cwr11m*105?@ nh b 35 1.0 0.5 5.0 6.0 4 6 6 6.5 cwr11m*155?@ nh c 35 1.5 0.5 5.0 6.0 6 8 9 4.5 cwr11m*225?@ nh c 35 2.2 0.8 8.0 9.6 6 8 9 3.5 cwr11m*335?@ nh c 35 3.3 1.2 12.0 14.4 6 8 9 2.5 cwr11m*475?@ nh d 35 4.7 1.7 17.0 20.4 6 8 9 1.5 cwr11n*104?@ nh a 50 0.10 0.5 5.0 6.0 4 6 6 22.0 cwr11n*154?@ nh b 50 0.15 0.5 5.0 6.0 4 6 6 17.0 cwr11n*224?@ nh b 50 0.22 0.5 5.0 6.0 4 6 6 14.0 cwr11n*334?@ nh b 50 0.33 0.5 5.0 6.0 4 6 6 12.0 cwr11n*474?@ nh c 50 0.47 0.5 5.0 6.0 4 6 6 8.0 cwr11n*684?@ nh c 50 0.68 0.5 5.0 6.0 6 6 6 7.0 cwr11n*105?@ nh c 50 1.0 0.5 5.0 6.0 6 6 6 6.0 cwr11n*155?@ nh d 50 1.5 0.8 8.0 9.6 6 8 9 4.0 cwr11n*225?@ nh d 50 2.2 1.1 11.0 13.2 6 8 9 2.5 * = termination finish designator: b = gold plated c = hot solder dipped k = solder fused ? = tolerance code j = ?% k = ?0% m = ?0% @ = failure rate level exponential: m = 1.0% per 1000 hours p = 0.1% per 1000 hours r = 0.01% per 1000 hours s = 0.001% per 1000 hours weibull: b = 0.1% per 1000 hours c = 0.01% per 1000 hours d = 0.001% per 1000 hours n = optional surge current a = 10 cycles at 25? b = 10 cycles at -55? and +85? h = packaging bulk standard \tr=7" tape & reel \tr13=13" tape & reel \w=waffle pack note: to complete the mil-c-55365/8 part number, additional information must be added: contact your local avx sales office for latest qualification status.
28 tantalum capacitors are manufactured from a powder of pure tantalum metal. the typical particle size is between 2 and 10 ?. 4000?v 10000?v 20000?v figure 1. the powder is compressed under high pressure around a tantalum wire to form a ?ellet?(known as the riser wire). the riser wire is the anode connection to the capacitor. this is subsequently vacuum sintered at high temperature (typically 1500 - 2000?). this helps to drive off any impuri- ties within the powder by migration to the surface. during sintering the powder becomes a sponge like structure with all the particles interconnected in a huge lattice. this structure is of high mechanical strength and density, but is also highly porous giving a large internal surface area (see figure 2). the larger the surface area the larger the capacitance. thus high cv (capacitance/voltage product) powders, which have a low average particle size, are used for low voltage, high capacitance parts. the figure below shows typical powders. note the very great difference in particle size between the powder cvs. by choosing which powder is used to produce each capac- itance/voltage rating the surface area can be controlled. the following example uses a 22? 25v capacitor to illustrate the point. c = ? o ? r a d where ? o is the dielectric constant of free space (8.855 x 10 -12 farads/m) ? r is the relative dielectric constant for tantalum pentoxide (27) d is the dielectric thickness in meters (for a typical 25v part) c is the capacitance in farads and a is the surface area in meters rearranging this equation gives: a = cd ? o ? r thus for a 22?/25v capacitor the surface area is 150 square centimeters, or nearly half the size of this page. the dielectric is then formed over all the tantalum surfaces by the electrochemical process of anodization. to achieve this, the ?ellet?is dipped into a very weak solution of phos- phoric acid. the dielectric thickness is controlled by the voltage applied during the forming process. initially the power supply is kept in a constant current mode until the correct thickness of dielectric has been reached (that is the voltage reaches the ?orming voltage?, it then switches to constant voltage mode and the current decays to close to zero. the chemical equations describing the process are as follows: anode: 2 ta ? 2 ta 5+ + 10 e 2 ta 5 + 10 oh- ? ta 2 o 5 + 5 h 2 o cathode: 10 h 2 o ?10 e ? 5h 2 - + 10 oh - the oxide forms on the surface of the tantalum but it also grows into the metal. for each unit of oxide two thirds grows out and one third grows in. it is for this reason that there is a limit on the maximum voltage rating of tantalum capacitors with present technology powders (see figure 3). the dielectric operates under high electrical stress. consider a 22? 25v part: formation voltage = formation ratio x working voltage = 4 x 25 = 100 volts technical summary and application guidelines figure 2. sintered tantalum introduction
29 technical summary and application guidelines the pentoxide (ta 2 o 5 ) dielectric grows at a rate of 1.7 x 10 -9 m/v dielectric thickness (d) = 100 x 1.7 x 10 -9 = 0.17 ? electric field strength = working voltage / d = 147 kv/mm the next stage is the production of the cathode plate. this is achieved by pyrolysis of manganese nitrate into manganese dioxide. the ?ellet?is dipped into an aqueous solution of nitrate and then baked in an oven at approximately 250? to produce the dioxide coat. the chemical equation is: mn (no 3 ) 2 ? mn o 2 + 2no 2 - this process is repeated several times through varying specific densities of nitrate to build up a thick coat over all internal and external surfaces of the ?ellet? as shown in figure 4. the ?ellet?is then dipped into graphite and silver to provide a good connection to the manganese dioxide cathode plate. electrical contact is established by deposition of carbon onto the surface of the cathode. the carbon is then coated with a conductive material to facilitate connection to the cathode termination. packaging is carried out to meet individual specifications and customer require- ments. this manufacturing technique is adhered to for the whole range of avx tantalum capacitors, which can be sub- divided into four basic groups: chip / resin dipped / rectangular boxed / axial. further information on the production of tantalum capacitors can be obtained from the technical paper "basic tantalum technology", by john gill, available from your local avx representative. tantalum manganese dioxide oxide film dielectric tantalum dielectric oxide film anode manganese dioxide graphite outer silver layer silver epoxy cathode connection figure 3. dielectric layer figure 4. manganese dioxide layer
30 technical summary and application guidelines 1.1 capacitance 1.1.1 rated capacitance (c r ). this is the nominal rated capacitance. for tantalum capaci- tors it is measured as the capacitance of the equivalent series circuit at 20? using a measuring bridge supplied by a 0.5vpk-pk 120hz sinusoidal signal, free of harmonics with a maximum bias of 2.2vd.c. 1.1.2 capacitance tolerance. this is the permissible variation of the actual value of the capacitance from the rated value. for additional reading, please consult the avx technical publication "capacitance tolerances for solid tantalum capacitors". 1.1.3 temperature dependence of capacitance. the capacitance of a tantalum capacitor varies with temper- ature. this variation itself is dependent to a small extent on the rated voltage and capacitor size. 1.1.4 frequency dependence of the capacitance. the effective capacitance decreases as frequency increases. beyond 100khz the capacitance continues to drop until res- onance is reached (typically between 0.5 - 5mhz depending on the rating). beyond the resonant frequency the device becomes inductive. 1.2 voltage 1.2.1 rated d.c. voltage (v r ) this is the rated d.c. voltage for continuous operation at 85?. 1.2.2 category voltage (v c ) this is the maximum voltage that may be applied continu- ously to a capacitor. it is equal to the rated voltage up to +85?, beyond which it is subject to a linear derating, to 2/3 v r at 125?. 1.2.3 surge voltage (v s ) this is the highest voltage that may be applied to a capaci- tor for short periods of time. the surge voltage may be applied up to 10 times in an hour for periods of up to 30 seconds at a time. the surge voltage must not be used as a parameter in the design of circuits in which, in the normal course of operation, the capacitor is periodically charged and discharged. 1.2.4 effect of surges the solid tantalum capacitor has a limited ability to withstand voltage and current surges. this is in common with all other electrolytic capacitors and is due to the fact that they oper- ate under very high electrical stress across the dielectric. for example a 25 volt capacitor has an electrical field of 147 kv/mm when operated at rated voltage. capacitance vs. frequency capacitance ( m f) 100 1000 10000 100000 1000000 frequency (hz) 250 200 150 100 50 0 85? 125? rated surge category surge voltage voltage voltage voltage (vdc.) (vdc.) (vdc.) (vdc.) 4 5.2 2.7 3.2 6.3 8 4 5 10 13 7.0 8 16 20 10 12 20 26 13 16 25 32 17 20 35 46 23 28 50 65 33 40 section 1 electrical characteristics and explanation of terms taje227k010
31 it is important to ensure that the voltage across the terminals of the capacitor never exceeds the specified surge voltage rating. solid tantalum capacitors have a self healing ability provided by the manganese dioxide semiconducting layer used as the negative plate. however, this is limited in low impedance applications. in the case of low impedance circuits, the capacitor is likely to be stressed by current surges. derating the capacitor by 50% or more increases the reliability of the component. (see figure 2 page 37). the ?vx recommended derating table (page 38) summarizes voltage rating for use on common voltage rails, in low impedance applications. in circuits which undergo rapid charge or discharge a pro- tective resistor of 1 /v is recommended. if this is impossible, a derating factor of up to 70% should be used. in such situations a higher voltage may be needed than is available as a single capacitor. a series combination should be used to increase the working voltage of the equivalent capacitor: for example two 22? 25v parts in series is equiv- alent to one 11? 50v part. for further details refer to j.a. gills paper ?nvestigation into the effects of connecting tantalum capacitors in series? available from avx offices worldwide. note: while testing a circuit (e.g. at ict or functional) it is likely that the capacitors will be subjected to large voltage and current transients, which will not be seen in normal use. these con- ditions should be borne in mind when considering the capacitors rated voltage for use. these can be controlled by ensuring a correct test resistance is used. 1.2.5 reverse voltage and non-polar operation. the values quoted are the maximum levels of reverse voltage which should appear on the capacitors at any time. these limits are based on the assumption that the capacitors are polarized in the correct direction for the majority of their working life. they are intended to cover short term reversals of polarity such as those occurring during switching tran- sients of during a minor portion of an impressed waveform. continuous application of reverse voltage without normal polarization will result in a degradation of leakage current. in conditions under which continuous application of a reverse voltage could occur two similar capacitors should be used in a back-to-back configuration with the negative terminations connected together. under most conditions this combination will have a capacitance one half of the nominal capacitance of either capacitor. under conditions of isolated pulses or during the first few cycles, the capacitance may approach the full nominal value. the reverse voltage ratings are designed to cover exception- al conditions of small level excursions into incorrect polarity. the values quoted are not intended to cover continuous reverse operation. the peak reverse voltage applied to the capacitor must not exceed: 10% of the rated d.c. working voltage to a maximum of 1.0v at 25? 3% of the rated d.c. working voltage to a maximum of 0.5v at 85? 1% of the category d.c. working voltage to a maximum of 0.1v at 125? 1.2.6 superimposed a.c. voltage (vr.m.s.) - ripple voltage. this is the maximum r.m.s. alternating voltage; superim- posed on a d.c. voltage, that may be applied to a capacitor. the sum of the d.c. voltage and peak value of the super-imposed a.c. voltage must not exceed the category voltage, vc. full details are given in section 2. 1.2.7 forming voltage. this is the voltage at which the anode oxide is formed. the thickness of this oxide layer is proportional to the formation voltage for a tantalum capacitor and is a factor in setting the rated voltage. 1.3 dissipation factor and tangent of loss angle (tan d ) 1.3.1 dissipation factor (d.f.). dissipation factor is the measurement of the tangent of the loss angle (tan d ) expressed as a percentage. the measure- ment of df is carried out using a measuring bridge which supplies a 0.5vpk-pk 120hz sinusoidal signal, free of har- monics with a maximum bias of 2.2vdc. the value of df is temperature and frequency dependent. note: for surface mounted products the maximum allowed df values are indicated in the ratings table and it is important to note that these are the limits met by the component after soldering onto the substrate. 1.3.2 tangent of loss angle (tan d ). this is a measurement of the energy loss in the capacitor. it is expressed as tan d and is the power loss of the capacitor divided by its reactive power at a sinusoidal voltage of spec- ified frequency. terms also used are power factor, loss factor and dielectric loss. cos (90 - d ) is the true power factor. the measurement of tan d is carried out using a measuring bridge which supplies a 0.5vpk-pk 120hz sinusoidal signal, free of harmonics with a maximum bias of 2.2vdc. technical summary and application guidelines
32 1.3.3 frequency dependence of dissipation factor. dissipation factor increases with frequency as shown in the typical curves: 1.3.4 temperature dependence of dissipation factor. dissipation factor varies with temperature as the typical curves show. for maximum limits please refer to ratings tables. 1.4 impedance, (z) and equivalent series resistance (esr) 1.4.1 impedance, z. this is the ratio of voltage to current at a specified frequency. three factors contribute to the impedance of a tantalum capacitor; the resistance of the semiconductor layer; the capacitance value and the inductance of the electrodes and leads. at high frequencies the inductance of the leads becomes a limiting factor. the temperature and frequency behavior of these three factors of impedance determine the behavior of the impedance z. the impedance is measured at 20? and 100khz. 1.4.2 equivalent series resistance, esr. resistance losses occur in all practical forms of capacitors. these are made up from several different mechanisms, including resistance in components and contacts, viscous forces within the dielectric and defects producing bypass current paths. to express the effect of these losses they are considered as the esr of the capacitor. the esr is frequency dependent and can be found by using the relationship; esr = tan d 2 fc where f is the frequency in hz, and c is the capacitance in farads. the esr is measured at 20? and 100khz. esr is one of the contributing factors to impedance, and at high frequencies (100khz and above) it becomes the dominant factor. thus esr and impedance become almost identical, impedance being only marginally higher. 1.4.3 frequency dependence of impedance and esr. esr and impedance both increase with decreasing frequency. at lower frequencies the values diverge as the extra contri- butions to impedance (due to the reactance of the capacitor) become more significant. beyond 1mhz (and beyond the resonant point of the capacitor) impedance again increases due to the inductance of the capacitor. df vs. frequency (tpse107m016r0100) df (%) 100 1000 10000 100000 frequency (hz) 500 450 400 350 300 250 200 150 100 50 0 df vs. temperature (tpse107m016r0100) -40 -20 0 20 40 60 80 100 125 temperature ( c) esr vs. frequency (tpse107m016r0100) esr (ohms) 1 0.1 0.01 100 1000 10000 100000 1000000 frequency (hz) 10 1 0.1 0.01 frequency (hz) 100 1000 10000 100000 1000000 impedance vs. frequency (tpse107m016r0100) impedance (ohms) technical summary and application guidelines
33 1.4.4 temperature dependence of the impedance and esr. at 100khz, impedance and esr behave identically and decrease with increasing temperature as the typical curves show. 1.5 d.c. leakage current 1.5.1 leakage current. the leakage current is dependent on the voltage applied, the elapsed time since the voltage was applied and the component temperature. it is measured at +20? with the rated voltage applied. a protective resistance of 1000 is connected in series with the capacitor in the measuring circuit. three to five minutes after application of the rated voltage the leakage current must not exceed the maximum values indicated in the ratings table. these are based on the formulae 0.01cv or 0.5? (whichever is the greater). reforming of tantalum capacitors is unnecessary even after prolonged storage periods without the application of voltage. 1.5.2 temperature dependence of the leakage current. the leakage current increases with higher temperatures, typical values are shown in the graph. for operation between 85? and 125?, the maximum working voltage must be derated and can be found from the following formula. vmax = x 1- (t - 85) c x v r volts, where t is the required 125 operating temperature. 1.5.3 voltage dependence of the leakage current. the leakage current drops rapidly below the value corre- sponding to the rated voltage v r when reduced voltages are applied. the effect of voltage derating on the leakage current is shown in the graph. this will also give a significant increase in the reliability for any application. see section 3.1 for details. for additional information on leakage current, please consult the avx technical publication "analysis of solid tantalum capacitor leakage current" by r. w. franklin. 1.5.4 ripple current. the maximum ripple current allowed can be calculated from the power dissipation limits for a given temperature rise above ambient temperature (please refer to section 2). esr vs. temperature 1 0.1 0.01 -55 -40 -20 0 20 40 temperature ( c) esr (ohms) 60 80 10 125 1 0.1 0.01 0 20 40 60 80 100 rated voltage (v r ) % leakage current ratio i/iv r leakage current vs. rated voltage typical range tajd336m006 tajd476m010 tajd336m016 tajc685m020 10 8 6 4 2 0 -2 -4 -6 -8 -10 leakage current ( a) -20 0 20 40 60 80 100 applied voltage (volts) leakage current vs. bias voltage -55 -40 -20 0 20 40 60 80 100 +125 10 1 0.1 temperature ( c) leakage current ratio i/i r20 leakage current vs. temperature technical summary and application guidelines
34 technical summary and application guidelines table i: power dissipation ratings (in free air) taj/tps/cwr11 taj/tps/cwr11 taz/cwr09 taz/cwr09 series molded chip series molded chip series molded chip 2.1 ripple ratings (a.c.) in an a.c. application heat is generated within the capacitor by both the a.c. component of the signal (which will depend upon the signal form, amplitude and frequency), and by the d.c. leakage. for practical purposes the second factor is insignificant. the actual power dissipated in the capacitor is calculated using the formula: p = i 2 r and rearranged to i = ( p r ) .....(eq. 1) and substituting p = e 2 r z 2 where i = rms ripple current, amperes r = equivalent series resistance, ohms e = rms ripple voltage, volts p = power dissipated, watts z = impedance, ohms, at frequency under consideration maximum a.c. ripple voltage (e max ). from the previous equation: e max = z ( p r ) .....(eq. 2) where p is the maximum permissible power dissipated as listed for the product under consideration (see tables). however care must be taken to ensure that: 1. the d.c. working voltage of the capacitor must not be exceeded by the sum of the positive peak of the applied a.c. voltage and the d.c. bias voltage. 2. the sum of the applied d.c. bias voltage and the negative peak of the a.c. voltage must not allow a voltage reversal in excess of the ?everse voltage? historical ripple calculations. previous ripple current and voltage values were calculated using an empirically derived power dissipation required to give a 10? rise of the capacitors body temperature from room temperature, usually in free air. these values are shown in table i. equation 1 then allows the maximum ripple current to be established, and equation 2, the maximum ripple voltage. but as has been shown in the avx article on thermal management by i. salisbury, the thermal conductivity of a tantalum chip capacitor varies considerably depending upon how it is mounted. case max. power size dissipation (w) a 0.075 b 0.085 c 0.110 d 0.150 e 0.165 m 0.090 n 0.130 r 0.055 s 0.065 t 0.080 v 0.250 case max. power size dissipation (w) a 0.050 b 0.070 c 0.075 d 0.080 e 0.090 f 0.100 g 0.125 h 0.150 temperature derating factors temp. ? factor +25 1.0 +55 0.90 +85 0.80 +125 0.16 temperature correction factor for ripple current temp. ? factor +25 1.0 +55 0.95 +85 0.90 +125 0.40 section 2 a.c. operation, ripple voltage and ripple current
35 a piece of equipment was designed which would pass sine and square wave currents of varying amplitudes through a biased capacitor. the temperature rise seen on the body for the capacitor was then measured using an infra-red probe. this ensured that there was no heat loss through any ther- mocouple attached to the capacitors surface. results for the c, d and e case sizes several capacitors were tested and the combined results are shown here. all these capacitors were measured on fr4 board, with no other heatsinking. the ripple was supplied at various frequencies from 1khz to 1mhz. as can be seen in the figure above, the average p max value for the c case capacitors was 0.11 watts. this is the same as that quoted in table i. the d case capacitors gave an average p max value 0.125 watts. this is lower than the value quoted in the table i by 0.025 watts. the e case capacitors gave an average p max of 0.200 watts which was much higher than the 0.165 watts from table i. if a typical capacitors esr with frequency is considered, e.g. figure below, it can be seen that there is variation. thus for a set ripple current, the amount of power to be dissipated by the capacitor will vary with frequency. this is clearly shown in figure in top of next column, which shows that the surface temperature of the unit rises less for a given value of ripple current at 1mhz than at 100khz. the graph below shows a typical esr variation with fre- quency. typical ripple current versus temperature rise for 100khz and 1mhz sine wave inputs. if i 2 r is then plotted it can be seen that the two lines are in fact coincident, as shown in figure below. example a tantalum capacitor is being used in a filtering application, where it will be required to handle a 2 amp peak-to-peak, 200khz square wave current. a square wave is the sum of an infinite series of sine waves at all the odd harmonics of the square waves fundamental frequency. the equation which relates is: i square = i pk sin (2 ? + i pk sin (6 ? + i pk sin (10 ? + i pk sin (14 ? +... thus the special components are: let us assume the capacitor is a tajd686m006 typical esr measurements would yield. thus the total power dissipation would be 0.069 watts. from the d case results shown in figure top of previous column, it can be seen that this power would cause the capacitors surface temperature to rise by about 5?. for additional information, please refer to the avx technical publication ?ipple rating of tantalum chip capacitors?by r.w. franklin. 100 90 80 70 60 50 40 30 20 10 0 0 0.1 0.2 0.3 0.4 0.5 power (watts) temperature rise ( o c) c case d case e case esr vs. frequency (tpse107m016r0100) esr (ohms) 1 0.1 0.01 100 1000 10000 100000 1000000 frequency (hz) 70 60 50 40 30 20 10 0 0.00 0.20 0.40 0.60 0.80 1.00 1.20 rms current (amps) temperature rise ( c) 100khz 1 mhz 70.00 60.00 50.00 40.00 30.00 20.00 10.00 0.00 0.00 0.05 0.45 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.50 f r temperature rise ( c) 100khz 1 mhz frequency typical esr power (watts) (ohms) irms 2 x esr 200 khz 0.120 0.060 600 khz 0.115 0.006 1 mhz 0.090 0.002 1.4 mhz 0.100 0.001 frequency peak-to-peak current rms current (amps) (amps) 200 khz 2.000 0.707 600 khz 0.667 0.236 1 mhz 0.400 0.141 1.4 mhz 0.286 0.101 technical summary and application guidelines
36 the heat generated inside a tantalum capacitor in a.c. operation comes from the power dissipation due to ripple current. it is equal to i 2 r, where i is the rms value of the current at a given frequency, and r is the esr at the same frequency with an additional contribution due to the leakage current. the heat will be transferred from the outer surface by conduction. how efficiently it is transferred from this point is dependent on the thermal management of the board. the power dissipation ratings given in section 2.1 are based on free-air calculations. these ratings can be approached if efficient heat sinking and/or forced cooling is used. in practice, in a high density assembly with no specific thermal management, the power dissipation required to give a 10? rise above ambient may be up to a factor of 10 less. in these cases, the actual capacitor temperature should be established (either by thermocouple probe or infra-red scanner) and if it is seen to be above this limit it may be necessary to specify a lower esr part or a higher voltage rating. please contact application engineering for details or contact the avx technical publication entitled ?hermal management of surface mounted tantalum capacitors?by ian salisbury. lead frame solder encapsulant copper printed circuit board tantalum anode 121 c\watt 73 c\watt 236 c\watt x - results of ripple current test - resin body x x x temperature deg c thermal impedance graph c case size capacitor body 140 120 100 80 60 40 20 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 power in unit case, dc watts = pcb max cu thermal = pcb min cu air gap = cap in free air thermal dissipation from the mounted chip thermal impedance graph with ripple current technical summary and application guidelines 2.2 thermal management
37 100.0 10.0 0.10 1.0 0.01 correction factor 20 30 40 50 60 70 80 90 100 110 120 temperature 1.0000 0.1000 0.0100 0.0010 0.0001 correction factor 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 applied voltage / rated voltage 3.1 steady-state tantalum dielectric has essentially no wear out mechanism and in certain circumstances is capable of limited self healing. however, random failures can occur in operation. the failure rate of tantalum capacitors will decrease with time and not increase as with other electrolytic capacitors and other electronic components. figure 1. tantalum reliability curve the useful life reliability of the tantalum capacitor is affected by three factors. the equation from which the failure rate can be calculated is: f = fu x ft x fr x fb where fu is a correction factor due to operating voltage/voltage derating ft is a correction factor due to operating temperature fr is a correction factor due to circuit series resistance fb is the basic failure rate level. for standard tantalum product this is 1%/1000 hours base failure rate. standard tantalum product conforms to level m reliability (i.e., 1%/1000 hrs.) at rated voltage, rated temperature, and 0.1 /volt circuit impedance. this is known as the base failure rate, fb, which is used for calculating operating reliability. the effect of varying the operating conditions on failure rate is shown on this page. operating voltage/voltage derating. if a capacitor with a higher voltage rating than the maximum line voltage is used, then the operating reliability will be improved. this is known as voltage derating. the graph, figure 2, shows the relationship between voltage derating (the ratio between applied and rated voltage) and the failure rate. the graph gives the correction factor fu for any operating voltage. figure 2. correction factor to failure rate f for voltage derating of a typical component (60% con. level). operating temperature. if the operating temperature is below the rated temperature for the capacitor then the operating reliability will be improved as shown in figure 3. this graph gives a correction factor ft for any temperature of operation. figure 3: correction factor to failure rate f for ambient temperature t for typical component (60% con. level). circuit impedance. all solid tantalum capacitors require current limiting resistance to protect the dielectric from surges. a series resistor is recommended for this purpose. a lower circuit impedance may cause an increase in failure rate, especially at temperatures higher than 20?. an inductive low imped- ance circuit may apply voltage surges to the capacitor and similarly a non-inductive circuit may apply current surges to the capacitor, causing localized over-heating and failure. the recommended impedance is 1 per volt. where this is not feasible, equivalent voltage derating should be used (see mil handbook 217e). the graph, figure 4, shows the correction factor, fr, for increasing series resistance. section 3 reliability and calculation of failure rate technical summary and application guidelines infinite useful life useful life reliability can be altered by voltage derating, temperature or series resistance infant mortalities
38 figure 4. correction factor to failure rate f for series resistance r on basic failure rate fb for a typical component (60% con. level). example calculation consider a 12 volt power line. the designer needs about 10? of capacitance to act as a decoupling capacitor near a video bandwidth amplifier. thus the circuit impedance will be limited only by the output impedance of the boards power unit and the track resistance. let us assume it to be about 2 ohms minimum, i.e. 0.167 ohms/volt. the operating temperature range is -25? to +85?. if a 10? 16 volt capacitor was designed in the operating failure rate would be as follows. a) ft = 1.0 @ 85? b) fr = 0.85 @ 0.167 ohms/volt c) fu = 0.08 @ applied voltage/rated voltage = 75% thus fb = 1.0 x 0.85 x 0.08 x 1 = 0.068%/1000 hours if the capacitor was changed for a 20 volt capacitor, the operating failure rate will change as shown. fu = 0.018 @ applied voltage/rated voltage = 60% fb = 1.0 x 0.85 x 0.018 x 1 = 0.0153%/1000 hours 3.2 dynamic. as stated in section 1.2.4, the solid tantalum capacitor has a limited ability to withstand voltage and current surges. such current surges can cause a capacitor to fail. the expected failure rate cannot be calculated by a simple formula as in the case of steady-state reliability. the two parameters under the control of the circuit design engineer known to reduce the incidence of failures are derating and series resistance. the table below summarizes the results of trials carried out at avx with a piece of equipment which has very low series resistance with no voltage derating applied. that is the capacitor was tested at its rated voltage. results of production scale derating experiment as can clearly be seen from the results of this experiment, the more derating applied by the user, the less likely the probability of a surge failure occurring. it must be remembered that these results were derived from a highly accelerated surge test machine, and failure rates in the low ppm are more likely with the end customer. a commonly held misconception is that the leakage current of a tantalum capacitor can predict the number of failures which will be seen on a surge screen. this can be disproved by the results of an experiment carried out at avx on 47? 10v surface mount capacitors with different leakage currents. the results are summarized in the table below. leakage current vs number of surge failures again, it must be remembered that these results were derived from a highly accelerated surge test machine, and failure rates in the low ppm are more likely with the end customer. avx recommended derating table for further details on surge in tantalum capacitors refer to j.a. gills paper ?urge in solid tantalum capacitors? available from avx offices worldwide. an added bonus of increasing the derating applied in a circuit, to improve the ability of the capacitor to withstand surge conditions, is that the steady-state reliability is improved by up to an order. consider the example of a 6.3 volt capacitor being used on a 5 volt rail. the steady-state reliability of a tantalum capacitor is affected by three parameters; temperature, series resistance and voltage derating. assume 40? operation and 0.1 ohms/volt series resistance. number tested number failed surge standard leakage range 10,000 25 0.1 ? to 1? over catalog limit 10,000 26 5? to 50? classified short circuit 10,000 25 50? to 500? capacitance number of 50% derating no derating and voltage units tested applied applied 47? 16v 1,547,587 0.03% 1.1% 100? 10v 632,876 0.01% 0.5% 22? 25v 2,256,258 0.05% 0.3% voltage rail working cap voltage 3.3 6.3 510 10 20 12 25 15 35 3 24 series combinations (11) circuit resistance fr ohms/volt 3.0 0.07 2.0 0.1 1.0 0.2 0.8 0.3 0.6 0.4 0.4 0.6 0.2 0.8 0.1 1.0 technical summary and application guidelines
39 technical summary and application guidelines dangerous range allowable range with preheat allowable range with care 270 260 250 240 230 220 210 200 0 2 4 6 8 10 12 soldering time (secs.) allowable range of peak temp./time combination for wave soldering temperature ( o c) the capacitors reliability will therefore be: failure rate = f u x f t x f r x 1%/1000 hours = 0.15 x 0.1 x 1 x 1%/1000 hours = 0.015%/1000 hours if a 10 volt capacitor was used instead, the new scaling factor would be 0.006, thus the steady-state reliability would be: failure rate = f u x f t x f r x 1%/1000 hours = 0.006 x 0.1 x 1 x 1%/1000 hours = 6 x 10 -4 %/1000 hours so there is an order improvement in the capacitors steady- state reliability. soldering conditions and board attachment. the soldering temperature and time should be the minimum for a good connection. a suitable combination for wavesoldering is 230 - 250? for 3 - 5 seconds. for vapor phase or infra-red reflow soldering the profile below shows allowable and dangerous time/temperature combinations. the profile refers to the peak reflow tempera- ture and is designed to ensure that the temperature of the internal construction of the capacitor does not exceed 220?. preheat conditions vary according to the reflow system used, maximum time and temperature would be 10 minutes at 150?. small parametric shifts may be noted immediately after reflow, components should be allowed to stabilize at room temperature prior to electrical testing. both taj and taz series are designed for reflow and wave soldering operations. in addition taz is available with gold terminations compatible with conductive epoxy or gold wire bonding for hybrid assemblies. dangerous range allowable range with care recommended range 0 15 30 45 60 time in seconds 260 250 240 230 220 210 temperature ( c) o allowable range of peak temp./time combination for ir reflow under the cecc 00 802 international specification, avx tantalum capacitors are a class a component. the capacitors can therefore be subjected to one ir reflow, one wave solder and one soldering iron cycle. if more aggressive mounting techniques are to be used please consult avx tantalum for guidance. section 4 application guidelines for tantalum capacitors
40 ir reflow wave soldering after soldering the assembly should preferably be allowed to cool naturally. in the event that assisted cooling is used, the ra te of change in temperature should not exceed that used in reflow. recommended ramp rate less than 2?/sec. technical summary and application guidelines section 4 application guidelines for tantalum capacitors recommended soldering profiles for surface mounting of tantalum capacitors is provided in figure below. vapor phase
41 epoxy ul rating oxygen index taj ul94 v-0 35% tps ul94 v-0 35% taz ul94 v-0 35% 5.1 acceleration 98.1m/s 2 (10g) 5.2 vibration severity 10 to 2000hz, 0.75mm of 98.1m/s 2 (10g) 5.3 shock trapezoidal pulse, 98.1m/s 2 for 6ms. 5.4 adhesion to substrate iec 384-3. minimum of 5n. 5.5 resistance to substrate bending the component has compliant leads which reduces the risk of stress on the capacitor due to substrate bending. 5.6 soldering conditions dip soldering is permissible provided the solder bath temperature is 270?, the solder time < 3 seconds and the circuit board thickness 3 1.0mm. 5.7 installation instructions the upper temperature limit (maximum capacitor surface temperature) must not be exceeded even under the most unfavorable conditions when the capacitor is installed. this must be considered particularly when it is positioned near components which radiate heat strongly (e.g. valves and power transistors). furthermore, care must be taken, when bending the wires, that the bending forces do not strain the capacitor housing. 5.8 installation position no restriction. 5.9 soldering instructions fluxes containing acids must not be used. 5.9.1 guidelines for surface mount footprints component footprint and reflow pad design for avx capacitors. the component footprint is defined as the maximum board area taken up by the terminators. the footprint dimensions are given by a, b, c and d in the diagram, which corre- sponds to w, max., a max., s min. and l max. for the com- ponent. the footprint is symmetric about the center lines. the dimensions x, y and z should be kept to a minimum to reduce rotational tendencies while allowing for visual inspection of the component and its solder fillet. dimensions ps (pad separation) and pw (pad width) are calculated using dimensions x and z. dimension y may vary, depending on whether reflow or wave soldering is to be performed. for reflow soldering, dimensions pl (pad length), pw (pad width), and psl (pad set length) have been calculated. for wave soldering the pad width (pww) is reduced to less than the termination width to minimize the amount of solder pick up while ensuring that a good joint can be produced. note: these recommendations (also in compliance with eia) are guidelines only. with care and control, smaller footprints may be considered for reflow soldering. nominal footprint and pad dimensions for each case size are given in the following tables: a x y d cb z pw pl ps psl section 7 qualification approval status section 6 epoxy flammability description style specification surface mount taj cecc 30801 - 005 issue 2 capacitors cecc 30801 - 011 issue 1 mil-c-55365/8 (cwr11) taz mil-c-55365/4 (cwr09) case psl pl ps pw pww taj a 4.0 (0.157) 1.4 (0.054) 1.2 (0.047) 1.8 (0.071) 0.9 (0.035) b 4.0 (0.157) 1.4 (0.054) 1.2 (0.047) 2.8 (0.110) 1.6 (0.063) c 6.5 (0.056) 2.0 (0.079) 2.5 (0.098) 2.8 (0.110) 1.6 (0.063) d 8.0 (0.315) 2.0 (0.079) 4.0 (0.157) 3.0 (0.119) 1.7 (0.068) v 8.3 (0.325) 2.3 (0.090) 3.7 (0.145) 6.2 (0.245) 1.7 (0.068) e 8.0 (0.315) 2.0 (0.079) 4.0 (0.157) 3.0 (0.119) 1.7 (0.068) r 2.7 (0.100) 1.0 (0.040) 1.0 (0.040) 1.6 (0.060) 0.8 (0.030) s 4.0 (0.160) 1.4 (0.050) 1.0 (0.040) 1.8 (0.070) 0.8 (0.030) t 4.0 (0.160) 1.4 (0.050) 1.0 (0.040) 2.8 (0.110) 0.8 (0.030) tac l 2.4 (0.095) 0.7 (0.027) 0.9 (0.035) 1.0 (0.039) - r 3.0 (0.120) 0.7 (0.027) 1.6 (0.063) 1.5 (0.059) - taz a 3.3 (0.126) 1.4 (0.054) 0.5 (0.020) 2.5 (0.098) 1.0 (0.039) b 4.5 (0.178) 1.4 (0.054) 1.8 (0.070) 2.5 (0.098) 1.0 (0.039) d 4.5 (0.178) 1.4 (0.054) 1.8 (0.070) 3.6 (0.143) 2.0 (0.079) e 5.8 (0.228) 1.4 (0.054) 3.0 (0.120) 3.6 (0.143) 2.2 (0.085) f 6.3 (0.248) 1.4 (0.054) 3.6 (0.140) 4.5 (0.178) 3.0 (0.119) g 7.4 (0.293) 1.9 (0.074) 3.7 (0.145) 4.0 (0.157) 2.4 (0.095) h 8.0 (0.313) 1.9 (0.074) 4.2 (0.165) 5.0 (0.197) 3.4 (0.135) section 5 mechanical and thermal properties of capacitors technical summary and application guidelines pad dimensions: millimeters (inches)
42 tac, taj & tps series tape and reel packaging case size tape width p 103mm (4") reel 180mm (7") reel 330mm (13") reel reference mm mm suffix qty. suffix qty. a 8 4 r 2000 s 8000 b 8 4 r 2000 s 8000 c 12 8 r 500 s 3000 d 12 8 r 500 s 2500 e 12 8 r 400 s 1500 v 12 8 r 400 s 1500 r 8 4 r 2500 s 10000 s 8 4 r 2500 s 10000 t 8 4 r 2500 s 10000 tacl 8 4 x 500 r 3500 tacr 8 4 x 500 r 2500 code 8mm tape 12mm tape 4?.1 (0.157?.004) 4?.1 (0.157?.004) p* or or 8?.1 (0.315?.004) 8?.1 (0.315?.004) g 0.75 min (0.03 min ) 0.75 min (0.03 min ) f 3.5?.05 (0.138?.002 ) 5.5?.05 (0.22?.002 ) e 1.75?.1 (0.069?.004 ) 1.75?.1 (0.069?.004 ) w 8?.3 (0.315?.012 ) 12?.3 (0.472?.012 ) p 2 2?.05 (0.079?.002 ) 2?.05 (0.079?.002 ) p 0 4?.1 (0.157?.004 ) 4?.1 (0.157?.004 ) d 1.5?.1 (0.059?.004 ) 1.5?.1 (0.059?.004 ) -0 (-0) -0 (-0) d 1 1.0 min (0.039 min ) 1.5 min (0.059 min ) *see taping suffix tables for actual p dimension (component pitch). tape specification tape dimensions comply to eia rs 481 a dimensions a 0 and b 0 of the pocket and the tape thickness, k, are dependent on the component size. tape materials do not affect component solderability during storage. carrier tape thickness <0.4mm plastic tape dimensions pp 0 b 0 d 1 a 0 p 2 e d w f positive termination g k tape and reel packaging for automatic component placement. please enter required suffix on order. bulk product is not available. tac, taj and tps taping suffix table total tape thickness ?k max tac/taj/tps case size reference k ao bo a 2.3 (0.090) 1.9 3.5 b 2.6 (0.102) 3.1 3.8 c 3.3 (0.130) 3.7 6.9 d 3.6 (0.142) 4.8 7.6 e 4.8 (0.189) 4.5 7.5 v 4.0 (0.156) 6.4 7.6 r 1.9 (0.075) 1.7 2.5 s 1.9 (0.075) 1.9 3.5 t 1.9 (0.075) 3.1 3.8 l 1.1 (0.043) 1.1 2.0 standard dimensions mm a: 9.5mm (8mm tape) 13.0mm (12mm tape) cover tape dimensions thickness: 75?5 width of tape: 5.5mm + 0.2mm (8mm tape) 9.5mm + 0.2mm (12mm tape)
43 taj & tps marking marking: taj series for taj, the positive end of body has videcon readable polarity bar marking, with the avx logo ??as shown in the diagram. bodies are marked by indelible laser marking on top surface with capacitance value, voltage and date of manufacture. due to the small size of the a, b, s and t cases, a voltage code is used as shown to the right. r case is an exception in which only the voltage and capacitance values are printed. voltage code rated voltage a, b, s and t cases at 85? f2 g4 j6.3 a10 c16 d20 e25 v35 t50 a, b, s and t case: 1. voltage code (see table) 2. capacitance in ? 3. date code c, d, e and v case: 1. capacitance in ? 2. rated voltage at 85? 3. date code polarity bar indicates anode (+) termination r case: 1. voltage 2. capacitance in ? 2 2 6v a10 9814 a 68 6.3 9819
44 taz, cwr09, cwr11 series tape and reel packaging solid tantalum chip taz tape and reel packaging for automatic component placement. please enter required suffix on order. bulk packaging is standard. taz taping suffix table case size tape width p 7" (180mm) reel 13" reel (330mm) reel reference mm mm suffix qty. suffix qty. a 8 4 r 2500 s 9000 b 12 4 r 2500 s 9000 d 12 4 r 2500 s 8000 e 12 4 r 2500 s 8000 f 12 8 r 1000 s 3000 g 12 8 r 500 s 2500 h 12 8 r 500 s 2500 code 8mm tape 12mm tape 4?.1 (0.157?.004) 4?.1 (0.157?.004) p* or or 8?.1 (0.315?.004) 8?.1 (0.315?.004) g 0.75 min (0.03 min ) 0.75 min (0.03 min ) f 3.5?.05 (0.138?.002 ) 5.5?.05 (0.22?.002 ) e 1.75?.1 (0.069?.004 ) 1.75?.1 (0.069?.004 ) w 8?.3 (0.315?.012 ) 12?.3 (0.472?.012 ) p 2 2?.05 (0.079?.002 ) 2?.05 (0.079?.002 ) p 0 4?.1 (0.157?.004 ) 4?.1 (0.157?.004 ) d 1.5?.1 (0.059?.004 ) 1.5?.1 (0.059?.004 ) -0 (-0) -0 (-0) d 1 1.0 min (0.039 min ) 1.5 min (0.059 min ) *see taping suffix tables for actual p dimension (component pitch). tape specification tape dimensions comply to eia rs 481 a dimensions a 0 and b 0 of the pocket and the tape thickness, k, are dependent on the component size. tape materials do not affect component solderability during storage. carrier tape thickness <0.4mm total tape thickness ?k max taz case size millimeters (inches) reference dim a 2.0 (0.079) b 4.0 (0.157) d 4.0 (0.157) e 4.0 (0.157) f 4.0 (0.157) g 4.0 (0.157) h 4.0 (0.157)
45 taz, cwr09, cwr11 series tape and reel packaging waffle packaging - 2" x 2" hard plastic waffle trays. to order waffle packaging use a ??in part numbers packaging position. note: orientation of parts in waffle packs varies by case size. . m . m . m . . . . 13 0.5 2 0.5 a 1.0 d max 50 min 21 1.0 maximum case size quantity per waffle taz a 160 taz b 112 taz d 88 taz e 60 taz f 48 taz g 50 taz h 28 cwr11 a 96 cwr11 b 72 cwr11 c 54 cwr11 d 28 plastic tape reel dimensions standard dimensions mm a: 9.5mm (8mm tape) 13.0mm (12mm tape) cover tape dimensions thickness: 75?5 width of tape: 5.5mm + 0.2mm (8mm tape) 9.5mm + 0.2mm (12mm tape)
46 questions & answers some commonly asked questions regarding tantalum capacitors: question: if i use several tantalum capacitors in serial/parallel combinations, how can i ensure equal current and voltage sharing? answer: connecting two or more capacitors in series and parallel combinations allows almost any value and rating to be constructed for use in an application. for example, a capacitance of more than 60? is required in a circuit for stable operation. the working voltage rail is 24 volts dc with a superimposed ripple of 1.5 volts at 120 hz. the maximum voltage seen by the capacitor is v dc + v ac =25.5v applying the 50% derating rule tells us that a 50v capacitor is required. connecting two 25v rated capacitors in series will give the required capacitance voltage rating, but the effective capacitance will be halved, so for greater than 60?, four such series combinations are required, as shown. in order to ensure reliable operation, the capacitors should be connected as shown below to allow current sharing of the ac noise and ripple signals. this prevents any one capacitor heating more than its neighbors and thus being the weak link in the chain. the two resistors are used to ensure that the leakage currents of the capacitors does not affect the circuit reliability, by ensuring that all the capacitors have half the working voltage across them. question: what are the advantages of tantalum over other capacitor technologies? answer: 1. tantalum capacitors have high volumetric efficiency. 2. electrical performance over temperature is very stable. 3. they have a wide operating temperature range -55 degrees c to +125 degrees c. 4. they have better frequency characteristics than aluminum electrolytics. 5. no wear out mechanism. because of their construction, solid tantalum capacitors do not degrade in perfor- mance or reliability over time. question: how does tps differ from your standard product? answer: tps has been designed from the initial anode production stages for power supply applications. special manufacturing processes provide the most robust capacitor dielectric by maximizing the volumetric efficiency of the package. after manufacturing, parts are conditioned by being subjected to elevated temperature overvoltage burn in applied for a minimum of two hours. parts are monitored on a 100% basis for their direct current leakage performance at elevated temperatures. parts are then subjected to a low impedance current surge. this current surge is performed on a 100% basis with each capacitor individually monitored. at this stage, the capacitor undergoes 100% test for capacitance, dissipation factor, leakage current, and 100 khz esr to tps requirements. question: if the part is rated as a 25 volt part and you have current surged it, why cant i use it at 25 volts in a low impedance circuit? answer: the high volumetric efficiency obtained using tantalum technology is accomplished by using an extremely thin film of tantalum pentoxide as the dielectric. even an application of the relatively low voltage of 25 volts will produce a large field strength as seen by the dielectric. as a result of this, derating has a significant impact on reliability as described under the reliability section. the following example uses a 22 microfarad capacitor rated at 25 volts to illustrate the point. the equation for determining the amount of surface area for a capacitor is as follows: 33? 25v 33? 25v 16.5? 50v 66f 50v 33f 25v + 100k 100k 100k
47 questions & answers c = ( (e) (e ) (a) ) / d a = ( (c) (d) ) /( (e )(e) ) a = ( (22 x 10 -6 ) (170 x 10 -9 ) ) / ( (8.85 x 10 -12 ) (27) ) a = 0.015 square meters (150 square centimeters) where c = capacitance in farads a = dielectric (electrode) surface area (m 2 ) d = dielectric thickness (space between dielectric) (m) e = dielectric constant (27 for tantalum) e = dielectric constant relative to a vacuum (8.855 x 10 -12 farads x m -1 ) to compute the field voltage potential felt by the dielectric we use the following logic. dielectric formation potential = formation ratio x working voltage = 4 x 25 formation potential = 100 volts dielectric (ta 2 o 5 ) thickness (d) is 1.7 x 10 -9 meters per volt d = 0.17 meters electric field strength = working voltage / d = (25 / 0.17 meters) = 147 kilovolts per millimeter = 147 megavolts per meter no matter how pure the raw tantalum powder or the precision of processing, there will always be impurity sites in the dielectric. we attempt to stress these sites in the factory with overvoltage surges, and elevated temperature burn in so that components will fail in the factory and not in your product. unfortunately, within this large area of tantalum pentoxide, impurity sites will exist in all capacitors. to minimize the possibility of providing enough activation energy for these impurity sites to turn from an amorphous state to a crystalline state that will conduct energy, series resistance and derating is recommended. by reducing the electric field within the anode at these sites, the tantalum capacitor has increased reliability. tantalums differ from other electrolytics in that charge transients are carried by electronic conduction rather than absorption of ions. question: what negative transients can solid tantalum capacitors operate under? answer: the reverse voltage ratings are designed to cover exceptional conditions of small level excursions into incorrect polarity. the values quoted are not intended to cover contin- uous reverse operation. the peak reverse voltage applied to the capacitor must not exceed: 10% of rated dc working voltage to a maximum of 1 volt at 25?. 3% of rated dc working voltage to a maximum of 0.5 volt at 85?. 1% of category dc working voltage to a maximum of 0.1 volt at 125?. question: i have read that manufacturers recommend a series resistance of 0.1 ohm per working volt. you suggest we use 1 ohm per volt in a low impedance circuit. why? answer: we are talking about two very different sets of circuit conditions for those recommendations. the 0.1 ohm per volt recommendation is for steady-state conditions. this level of resistance is used as a basis for the series resistance variable in a 1% / 1000 hours 60% confidence level reference. this is what steady-state life tests are based on. the 1 ohm per volt is recommended for dynamic conditions which include current in-rush applications such as inputs to power supply circuits. in many power supply topologies where the di/dt through the capacitor(s) is limited, (such as most implementations of buck (current mode), forward converter, and flyback), the requirement for series resistance is decreased. question: how long is the shelf life for a tantalum capacitor? answer: solid tantalum capacitors have no limitation on shelf life. the dielectric is stable and no reformation is required. the only factors that affect future performance of the capacitors would be high humidity conditions and extreme storage temperatures. solderability of solder coated surfaces may be affected by storage in excess of one year under temperatures greater than 40? or humidities greater than 80% relative humidity. terminations should be checked for solderability in the event an oxidation develops on the solder plating. question: do you recommend the use of tantalum capacitors on the input side of dc-dc converters? answer: no. typically the input side of a converter is fed from the voltage sources which are not regulated and are of nominally low impedance. examples would be nickel-metal- hydride batteries, nickel-cadmium batteries, etc., whose internal resistance is typically in the low milliohm range.
48 technical publications 1. steve warden and john gill, ?pplication guidelines on ir reflow of surface mount solid tantalum capacitors. 2. john gill, ?lossary of terms used in the tantalum industry. 3. r.w. franklin, ?ver-heating in failed tantalum capacitors,?avx ltd. 4. r.w. franklin, ?pgraded surge performance of tantalum capacitors,?electronic engineering 1985 5. r.w. franklin, ?creening beats surge threat, electronics manufacture & test, june 1985 6. avx surface mounting guide 7. ian salisbury, ?hermal management of surface mounted tantalum capacitors,?avx 8. john gill, ?nvestigation into the effects of connecting tantalum capacitors in series,?avx 9. ian salisbury, ?nalysis of fusing technology for tantalum capacitors,?avx-kyocera group company 10. r.w. franklin, ?nalysis of solid tantalum capacitor leakage current,?avx ltd. 11. r.w. franklin, ?n exploration of leakage current, avx, ltd. 12. w illiam a. millman, ?pplication specific smd tantalum capacitors,?technical operations, avx ltd. 13. r.w. franklin, ?apacitance tolerances for solid tantalum capacitors,?avx ltd. 14. arch g. martin, ?ecoupling basics,?avx corporation 15. r.w. franklin, ?quivalent series resistance of tantalum capacitors,?avx ltd. 16. john stroud, ?olded surface mount tantalum capacitors vs conformally coated capacitors,? avx corporation, tantalum division 17. chris reynolds, ?eliability management of tantalum capacitors,?avx tantalum corporation 18. r.w. franklin, ?ipple rating of tantalum chip capacitors,?avx ltd. 19. chris reynolds, ?etting standard sizes for tantalum chips,?avx corporation 20. john gill, ?urge in solid tantalum capacitors,? avx ltd. 21. david mattingly, ?ncreasing reliability of smd tantalum capacitors in low impedance applications, avx corporation 22. john gill, ?asic tantalum technology,?avx ltd. 23. ian salisbury, ?older update reflow mounting tacmicrochip tantalum capacitor,?avx ltd. 24. ian salisbury, ?ew tantalum capacitor design for 0603 size,?avx ltd. 25. john gill, ?apacitor technology comparison,? avx ltd. 26. scott chiang, ?igh performance cpu capacitor requirements, how avx can help,?avx kyocera taiwan 27. john gill and ian bishop, "reverse voltage behavior of solid tantalum capacitors." as the worlds broadest line molded tantalum chip supplier, it is our mission to provide first in class technology, quality and service, by establishing progressive design, manufacturing and continuous improvement programs driving toward a single goal: total customer satisfaction. please contact avx for application engineering assistance. notice: specifications are subject to change without notice. contact your nearest avx sales office for the latest specification s. all statements, information and data given herein are believed to be accurate and reliable, but are presented without guarantee, warranty, or responsibility of any kind, expressed or implied. statements or suggestions concerning possible use of our products are made without representation or warranty that any such use is free of patent infringement and are not recommendations to infringe any patent. the user should not assume that all safety measures are indicated or that other measures may not be required. specifications are typical and may not apply to all applications.
49 fax back avx usa: 843-626-5186 avx europe: ++44-1252-770004 avx asia: ++65-3504-880 name: company: address: zip code: tel. no: fax no: project launch date: uu u u 0-3mths 3-6mths 6-12mths . 12mths circuit application: uu u u u decoupling timing filtering dc blocking other market sector: uu u u u u telecoms auto pc storage power supply industrial uu cellular other please rank your critical design factors between 1-6 (1 most critical) uu u u u u size max impedance temperature leakage height capacitance stability current please specify any cv ratings required outside of current matrix: what other smd products are used in this project: uu u u u u ceramic aluminum film chip arrays conductive os-con polymer please specify any non standard special requirements: uu u u u non std cap low esr temp cap tolerance interest in specials shown overleaf of short form catalog forecast usage of tantalum: 1998 1999 2000 standard smd tantalum tacmicrochip favored supplier, please rank 1-5 (1 most favorable): uu u u u u avx hitachi kemet nec sprague other other engineers in your company who would like information: please specify sample requirements: for further information and sample availability. capacitance voltage
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